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Ahmad HassanDépartement de génie électrique
Voir sa fiche dans le Répertoire des Expertises de Polytechnique Montréal
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Amer, M., Abuelnasr, A., Ali, M., Hassan, A., Trigui, A., Ragab, A., Sawan, M., & Savaria, Y. (2024). Enhanced dynamic regulation in Buck Converters: integrating input-voltage feedforward with voltage-mode feedback. IEEE Access, 12, 7310-7328. Disponible
Altoobaji, I., Hassan, A., Ali, M., Audet, Y., & Lakhssassi, A. (juin 2024). Capacitively Isolated 400 Mbps Data Transfer System with 2 Ns Propagation Delay and 5 kV /μs Common Mode Transient Immunity [Communication écrite]. 22nd IEEE Interregional NEWCAS Conference (NEWCAS 2024), Sherbrooke, QC, Canada. Lien externe
Abuelnasr, A., Amer, M., Ali, M., Hassan, A., Gosselin, B., Ragab, A. R. A., & Savaria, Y. (2023). Delay Mismatch Insensitive Dead Time Generator for High-Voltage Switched-Mode Power Amplifiers. IEEE Transactions on Circuits and Systems I: Regular Papers, 70(4), 1555-1565. Disponible
Altoobaji, I., Hassan, A., Ali, M., Nabavi, M., Audet, Y., & Lakhssassi, A. (2023). A Fully Integrated 0.6 Gbps Data Communication System for Inductive-Based Digital Isolator with 0.8 ns Propagation Delay and 10(-15) BER. Electronics, 12(15), 3336 (15 pages). Lien externe
Amer, M., Abuelnasr, A., Hassan, A., Ragab, A., Sawan, M., & Savaria, Y. (2023). A Half-bridge Gate Driver with Self-adjusting and Tunable Dead-time Modes for Efficient Switched-mode Power Systems. IEEE Transactions on Power Electronics, 15 pages. Lien externe
Ali, M., Hassan, A., Honarparvar, M., Nabavi, M., Audet, Y., Sawan, M., & Savaria, Y. (2022). A Versatile SoC/SiP Sensor Interface for Industrial Applications: Implementation Challenges. IEEE Access, 10, 24540-24555. Lien externe
Amer, M., Abuelnasr, A., Ragab, A., Hassan, A., Ali, M., Gosselin, B., Sawan, M., & Savaria, Y. (mai 2021). Design and analysis of combined input-voltage feedforward and PI controllers for the buck converter [Communication écrite]. 53rd IEEE International Symposium on Circuits and Systems (ISCAS 2021), Daegu, Korea (5 pages). Lien externe
Altoobaji, I., Ali, M., Hassan, A., Audet, Y., & Lakhssassi, A. (juin 2021). A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 m CMOS for Industrial Sensor Interfaces [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Amer, M., Ali, M., Abuelnasr, A., Hassan, A., Nabavi, M., Savaria, Y., & Sawan, M. (juin 2020). Fully integrated dual-channel gate driver and area efficient pid compensator for surge tolerant power sensor interface [Communication écrite]. 18th IEEE International New Circuits and Systems Conference (NEWCAS 2020), Montréal, Qc, Canada. Lien externe
Altoobaji, I., Ali, M., Hassan, A., Nabavi, M., Audet, Y., & Lakhssassi, A. (août 2020). A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation [Communication écrite]. 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2020), Springfield, MA, USA. Lien externe
Abuelnasr, A., Ali, M., Amer, M., Nabavi, M., Hassan, A., Gosselin, B., & Savaria, Y. (octobre 2020). Self-Adjusting Deadtime Generator for High-Efficiency High-Voltage Switched-Mode Power Amplifiers [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2020), Sevilla, Spain (5 pages). Lien externe
Ali, M., Nabavi, M., Hassan, A., Honarparvar, M., Savaria, Y., & Sawan, M. (décembre 2019). A versatile SoC/SiP sensor interface for industrial applications: Design considerations [Communication écrite]. 31st International Conference on Microelectronics (ICM 2019), Cairo, Egypt. Lien externe
Amer, M., Hassan, A., Ragab, A., Yacout, S., Savaria, Y., & Sawan, M. (mai 2018). High-Temperature Empirical Modeling for the I-V Characteristics of GaN150-Based HEMT [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2018), Florence, Italy. Lien externe
Abubakr, A., Hassan, A., Ragab, A., Yacout, S., Savaria, Y., & Sawan, M. (mai 2018). High-temperature modeling of the I-V characteristics of GaN150 HEMT using machine learning techniques [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2018), Florence, Italie (5 pages). Lien externe
El-Zarif, N., Amer, M., Ali, M., Hassan, A., Oukaira, A., Fayomi, C., & Savaria, Y. (2024). Calibration of ring oscillator-based integrated temperature sensors for power management systems. Sensors, 24(2), 440 (17 pages). Disponible
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (juin 2022). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Communication écrite]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. Lien externe
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (juin 2021). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Disponible
El-Zarif, N., Ali, M., Hassan, A., Nabavi, M., Fayomi, C. J. B., & Savaria, Y. (février 2020). A High Efficiency and Fast Response PLL Based Buck Converter: Implementation and Simulation [Communication écrite]. IEEE 11th Latin American Symposium on Circuits & Systems (LASCAS 2020), San Jose, Costa Rica (4 pages). Lien externe
Esmaeilzadeh, M., Ali, M., Hassan, A., Audet, Y., & Sawan, M. (juin 2020). Low-power high-accuracy VCO-based comparator for sensor interface applications [Communication écrite]. 18th IEEE International New Circuits and Systems Conference (NEWCAS 2020), Montréal, Qc, Canada. Lien externe
Esmaeilzadeh, M., Ali, M., Hassan, A., Nabavi, M., Gosselin, B., & Sawan, M. (octobre 2020). A tunable CMOS thyristor-based pulse generator for integrated sensor interface applications [Communication écrite]. 52nd IEEE International Symposium on Circuits and Systems (ISCAS 2020) (5 pages). Lien externe
Hassan, A., Trigui, A., Savaria, Y., & Sawan, M. (septembre 2023). High-Temperature Fully Integrated Wireless Monitoring Systems for Aerospace Applications [Communication écrite]. IEEE International Conference on Wireless for Space and Extreme Environments (WiSEE 2023), Aveiro, Portugal. Lien externe
Hassan, A., Noël, J.-P., Savaria, Y., & Sawan, M. (2022). Circuit Techniques in GaN Technology for High-Temperature Environments. Electronics, 11(1), 22 pages. Lien externe
Hassan, A., Amer, M., Savaria, Y., & Sawan, M. (2020). Fully Integrated Digital GaN-based LSK Demodulator for High-Temperature Applications. IEEE Transactions on Circuits and Systems II: Express Briefs, 67(9), 1579-1583. Disponible
Hassan, A., Amer, M., Savaria, Y., & Sawan, M. (juin 2020). Towards GaN500-based high temperature ICs: Characterization and modeling up to 600°C [Communication écrite]. 18th IEEE International New Circuits and Systems Conference (NEWCAS 2020), Montréal, Qc, Canada. Lien externe
Hassan, A., Ali, M., Trigui, A., Savaria, Y., & Sawan, M. (2019). A GaN-based wireless monitoring system for high-temperature applications. Sensors, 19(8), 1785 (17 pages). Disponible
Hassan, A. (2019). Circuits Techniques for Wireless Sensing Systems in High-Temperature Environments [Thèse de doctorat, Polytechnique Montréal]. Disponible
Hassan, A., Ali, M., Savaria, Y., & Sawan, M. (2019). GaN-based LSK demodulators for wireless data receivers in high-temperature applications. Microelectronics Journal, 84, 129-135. Disponible
Hassan, A., Savaria, Y., & Sawan, M. (2018). Electronics and Packaging Intended for Emerging Harsh Environment Applications: A Review. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 26(10), 2085-2098. Disponible
Hasanuzzaman, M., Motlagh, B. G., Mounaïm, F., Hassan, A., Raut, R., & Sawan, M. (2018). Toward an energy-efficient high-voltage compliant visual intracortical multichannel stimulator. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 26(5), 878-891. Disponible
Hassan, A., Savaria, Y., & Sawan, M. (2018). GaN Integration Technology, an Ideal Candidate for High-Temperature Applications: A Review. IEEE Access, 6, 78790-78802. Lien externe
Hassan, A., Ali, M., Trigui, A., Hached, S., Savaria, Y., & Sawan, M. (juin 2017). Stability of GaN150-based HEMT in high temperature up to 400°C [Communication écrite]. 15th IEEE International New Circuits and Systems Conference (NEWCAS 2017), Strasbourg, France. Lien externe
Hassan, A., Trigui, A., & Sawan, M. (février 2016). Wireless monitoring of collagen progression around implantable prostheses [Communication écrite]. 7th IEEE Latin American Symposium on Circuits & Systems (LASCAS 2016), Florianopolis, Brazil. Lien externe
Hassan, A., Trigui, A., Shafique, U., Savaria, Y., & Sawan, M. (mai 2016). Wireless power transfer through metallic barriers enclosing a harsh environment, feasibility and preliminary results [Affiche]. IEEE International Symposium on Circuits and Systems (ISCAS 2016), Montréal, Québec. Lien externe
Hassan, A., Sawma, C., Hasanuzzaman, M., Gosselin, B., & Sawan, M. (octobre 2015). Spatial carrier position modulation based multichannel capacitive link for bioelectronic implants [Communication écrite]. 11th IEEE Biomedical Circuits and Systems Conference (BioCAS 2015), Atlanta, GA, United states (4 pages). Lien externe
Hassan, A., Gosselin, B., & Sawan, M. (décembre 2015). Ultra-low power CMOS voltage reference for high temperature applications up to 300°C [Communication écrite]. IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2015), Cairo, Egypt. Lien externe
Karimi, M., Ali, M., Aghajani, A., Hassan, A., Sawan, M., & Gosselin, B. (2022). A 9.2-ns to 1-μs digitally controlled multituned deadtime optimization for efficient GaN HEMT power converters. IEEE Transactions on Circuits and Systems I: Regular Papers, 69(11), 4381-4394. Disponible
Karimi, M., Ali, M., Hassan, A., Sawan, M., & Gosselin, B. (2022). An Active Dead-Time Control Circuit With Timing Elements for a 45-V Input 1-MHz Half-Bridge Converter. IEEE Transactions on Circuits and Systems I: Regular Papers, 69(1), 30-41. Disponible
Karimi, M., Ali, M., Hassan, A., Bostani, R., Vaisband, B., Sawan, M., & Gosselin, B. (2022). A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. IEEE Access, 10, 132432-132447. Lien externe
Karimi, M., Ali, M., Hassan, A., Sawan, M., & Gosselin, B. (décembre 2021). An Independent Dynamic Dead-Time Control for Reliable High-Voltage High-Frequency Half-Bridge Converters [Présentation]. Dans International Symposium on Integrated Circuits and Systems, Singapore. Lien externe
Karimi, M., Ali, M., Hassan, A., Sawan, M., & Gosselin, B. (mai 2021). A reconfigurable single-supply multiple-level down-shifter for system-on-chip applications [Communication écrite]. 53rd IEEE International Symposium on Circuits and Systems (ISCAS 2021), Daegu, Korea (5 pages). Lien externe
Karimi, M., Ali, M., Hassan, A., Sawan, M., & Gosselin, B. (juin 2021). A Wide-range Reconfigurable Deadtime and Delay Element for Optimal-Power Conversion [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Karimi, M., Ali, M., Hassan, A., Weber-Boisvert, G., Abuelnasr, A., Sawan, M., & Gosselin, B. (juin 2020). A 1.99-ns 0.5-pJ wide frequency range level shifter with closed-loop negative feedback [Communication écrite]. 18th IEEE International New Circuits and Systems Conference (NEWCAS 2020), Montréal, Qc, Canada. Lien externe
Karimi, M., Ali, M., Nabavi, M., Hassan, A., Amer, M., Sawan, M., & Gosselin, B. (octobre 2020). A versatile non-overlapping signal generator for efficient power-converters operation [Communication écrite]. 52nd IEEE International Symposium on Circuits and Systems (ISCAS 2020) (5 pages). Lien externe
Mirfakhraei, S. S., Audet, Y., Hassan, A., & Sawan, M. (2022). A Fully Integrated Low-Power Hall-Based Isolation Amplifier With IMR Greater Than 120 dB. IEEE Transactions on Circuits and Systems I: Regular Papers, 69(4), 1385-1394. Disponible
Mirfakhraei, S. S., Audet, Y., Hassan, A., & Sawan, M. (2022). A Small Footprint Digital Isolator based on CMOS Integrated Hall-effect Sensor. IEEE Sensors Journal, 22(1), 412-418. Disponible
Mirfakhraei, S. S., Audet, Y., Hassan, A., & Sawan, M. (2021). A Galvanic Isolated Amplifier Based on CMOS Integrated Hall-Effect Sensors. IEEE Transactions on Circuits and Systems I-Regular Papers, 68(4), 1388-1397. Disponible
Mirfakhraei, S. S., Audet, Y., Hassan, A., Ali, M., Nabavi, M., & Sawan, M. (juin 2020). A CMOS MAGFET-based programmable isolation amplifier [Communication écrite]. 18th IEEE International New Circuits and Systems Conference (NEWCAS 2020), Montréal, Qc, Canada. Lien externe
Mirfakhraei, S. S., Audet, Y., Nabavi, M., Youness, B., Ali, M., Hassan, A., & Sawan, M. (octobre 2020). Wide Dynamic Range Front-End Programmable Isolation Amplifier using Integrated CMOS Hall Effect Sensor [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2020), Sevilla, Spain (5 pages). Lien externe
Oukaira, A., Said, D., Touati, D. E., El-Zarif, N., Hassan, A., Savaria, Y., & Lakhssassi, A. (2024). Novel peak-source-scanning (NPSS) model for thermal control of systems-in-package (SiP). IEEE Access, 12, 14842-14853. Disponible
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (octobre 2022). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Communication écrite]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). Lien externe
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). Lien externe
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (août 2021). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Communication écrite]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. Lien externe
Sawma, C., Hassan, A., Kassem, A., Al-Maadeed, S., & Sawan, M. (2018). Bidirectional parallel capacitive data links: Modeling and experimental results. IEEE Access, 6, 39787-39796. Disponible
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal analysis of system in package considering boundary conditions for long-term reliability studies. IEEE Access, 12, 3396373 (12 pages). Disponible
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Disponible
Zhang, H., Hassan, A., Chen, P., Snelgrove, W. M., & Carusone, A. C. (2022). Estimation of Broadband Time-Interleaved ADC's Impairments and Performance Using Only Single-Tone Measurements. IEEE Access, 10, 50403-50417. Lien externe
