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Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs)

Aziz Oukaira, Djallel Eddine Touati, Ahmad Hassan, Mohamed Ali, Yvon Savaria and Ahmed Lakhssassi

Paper (2021)

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Department: Department of Electrical Engineering
ISBN: 9781665424615
PolyPublie URL: https://publications.polymtl.ca/49492/
Conference Title: IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021)
Conference Location: Lansing, MI, USA
Conference Date(s): 2021-08-09 - 2021-08-11
Publisher: IEEE
DOI: 10.1109/mwscas47672.2021.9531747
Official URL: https://doi.org/10.1109/mwscas47672.2021.9531747
Date Deposited: 18 Apr 2023 15:00
Last Modified: 08 Apr 2025 14:40
Cite in APA 7: Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. https://doi.org/10.1109/mwscas47672.2021.9531747

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