Aziz Oukaira, Djallel Eddine Touati, Ahmad Hassan, Mohamed Ali, Yvon Savaria
and Ahmed Lakhssassi
Paper (2021)
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| Department: | Department of Electrical Engineering |
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| ISBN: | 9781665424615 |
| PolyPublie URL: | https://publications.polymtl.ca/49492/ |
| Conference Title: | IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021) |
| Conference Location: | Lansing, MI, USA |
| Conference Date(s): | 2021-08-09 - 2021-08-11 |
| Publisher: | IEEE |
| DOI: | 10.1109/mwscas47672.2021.9531747 |
| Official URL: | https://doi.org/10.1109/mwscas47672.2021.9531747 |
| Date Deposited: | 18 Apr 2023 15:00 |
| Last Modified: | 08 Apr 2025 14:40 |
| Cite in APA 7: | Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. https://doi.org/10.1109/mwscas47672.2021.9531747 |
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