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El-Zarif, N., Amer, M., Ali, M., Hassan, A., Oukaira, A., Fayomi, C., & Savaria, Y. (2024). Calibration of ring oscillator-based integrated temperature sensors for power management systems. Sensors, 24(2), 440 (17 pages). Available
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (2022, June). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Paper]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. External link
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (2021, June). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Available
Oukaira, A., Said, D., Touati, D. E., El-Zarif, N., Hassan, A., Savaria, Y., & Lakhssassi, A. (2024). Novel peak-source-scanning (NPSS) model for thermal control of systems-in-package (SiP). IEEE Access, 12, 14842-14853. Available
Oukaira, A., Savaria, Y., Boukadoum, M., & Lakhssassi, A. (2024, May). Advanced Simulation and Design Methodology of Josephson Traveling-Wave Parametric Amplifiers (JTWPA) for Quantum Electronics Applications [Paper]. 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET 2024), Fez, Morocco (5 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022, October). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Paper]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). External link
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. External link
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal analysis of system in package considering boundary conditions for long-term reliability studies. IEEE Access, 12, 3396373 (12 pages). Available
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Available
