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El-Zarif, N., Amer, M., Ali, M., Hassan, A., Oukaira, A., Fayomi, C., & Savaria, Y. (2024). Calibration of ring oscillator-based integrated temperature sensors for power management systems. Sensors, 24(2), 440 (17 pages). Disponible
Oukaira, A., Savaria, Y., Boukadoum, M., & Lakhssassi, A. (mai 2024). Advanced Simulation and Design Methodology of Josephson Traveling-Wave Parametric Amplifiers (JTWPA) for Quantum Electronics Applications [Communication écrite]. 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET 2024), Fez, Morocco (5 pages). Lien externe
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies. IEEE Access, 12, 3396373 (12 pages). Lien externe
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Disponible
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (octobre 2022). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Communication écrite]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). Lien externe
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (juin 2022). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Communication écrite]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. Lien externe
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). Lien externe
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (juin 2021). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (août 2021). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Communication écrite]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. Lien externe
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Disponible