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Collaboration networkThis graph maps the connections between all the collaborators of {}'s publications listed on this page.
Each link represents a collaboration on the same publication. The thickness of the link represents the number of collaborations.
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Word cloudA word cloud is a visual representation of the most frequently used words in a text or a set of texts. The words appear in different sizes, with the size of each word being proportional to its frequency of occurrence in the text. The more frequently a word is used, the larger it appears in the word cloud. This technique allows for a quick visualization of the most important themes and concepts in a text.
In the context of this page, the word cloud was generated from the publications of the author {}. The words in this cloud come from the titles, abstracts, and keywords of the author's articles and research papers. By analyzing this word cloud, you can get an overview of the most recurring and significant topics and research areas in the author's work.
The word cloud is a useful tool for identifying trends and main themes in a corpus of texts, thus facilitating the understanding and analysis of content in a visual and intuitive way.
Oukaira, A., Said, D., Touati, D. E., El-Zarif, N., Hassan, A., Savaria, Y., & Lakhssassi, A. (2024). Novel peak-source-scanning (NPSS) model for thermal control of systems-in-package (SiP). IEEE Access, 12, 14842-14853. Available
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022, October). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Paper]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. External link
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal analysis of system in package considering boundary conditions for long-term reliability studies. IEEE Access, 12, 3396373 (12 pages). Available
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Available
