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Altoobaji, I., Hassan, A., Ali, M., Nabavi, M., Audet, Y., & Lakhssassi, A. (2023). A Fully Integrated 0.6 Gbps Data Communication System for Inductive-Based Digital Isolator with 0.8 ns Propagation Delay and 10(-15) BER. Electronics, 12(15), 3336 (15 pages). External link
Altoobaji, I., Ali, M., Hassan, A., Audet, Y., & Lakhssassi, A. (2021, June). A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 m CMOS for Industrial Sensor Interfaces [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Altoobaji, I., Ali, M., Hassan, A., Nabavi, M., Audet, Y., & Lakhssassi, A. (2020, August). A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation [Paper]. 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2020), Springfield, MA, USA. External link
Baratli, K., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (2013, June). A netlist pruning tool for an electronic system prototyping platform [Paper]. 11th IEEE International New Circuits and Systems Conference (NEWCAS 2013), Paris, France. External link
Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquiere, Y., Savaria, Y., Norman, R., & Prytula, R. (2010, December). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Paper]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. External link
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (2022, June). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Paper]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. External link
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (2021, June). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Available
Guillemot, M., Nguyen, H., Bougataya, M., Blaquiere, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. In Novel Advances in Microsystems Technologies and Their Applications (67-100). External link
Lakhssassi, A., Palenychka, R., Savaria, Y., Sayde, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. External link
Nour, M., Gendreau, M., & Lakhssassi, A. (2018). Automatic laser interstitial thermal therapy for robot-assisted surgery. Global Journal of Advanced Engineering Technologies and Sciences, 5(3), 8-14. External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022, October). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Paper]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). External link
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. External link
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (2017, June). Hybrid features of tamura texture and shape-based image retrieval [Paper]. 5th International Conference on Advanced Computing, Networking, and Informatics (ICACNI 2017), Goa, India. External link
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (2018, July). Thermal image processing to Recognize and Quantify Pain in Human Body [Paper]. International Conference on Smart Computing and Electronic Enterprise (ICSCEE 2018), Shah Alam, Malaysia (5 pages). External link
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Available
