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Altoobaji, I., Hassan, A., Ali, M., Audet, Y., & Lakhssassi, A. (2024, June). Capacitively Isolated 400 Mbps Data Transfer System with 2 Ns Propagation Delay and 5 kV /μs Common Mode Transient Immunity [Paper]. 22nd IEEE Interregional NEWCAS Conference (NEWCAS 2024), Sherbrooke, QC, Canada. External link
Altoobaji, I., Hassan, A., Ali, M., Nabavi, M., Audet, Y., & Lakhssassi, A. (2023). A Fully Integrated 0.6 Gbps Data Communication System for Inductive-Based Digital Isolator with 0.8 ns Propagation Delay and 10(-15) BER. Electronics, 12(15), 3336 (15 pages). External link
Altoobaji, I., Hassan, A., Ali, M., Audet, Y., & Lakhssassi, A. (2023). A Low-Power 0.68-Gbps Data Communication System for Capacitive Digital Isolator With 1.9-ns Propagation Delay. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 5 pages. External link
Altoobaji, I., Ali, M., Hassan, A., Audet, Y., & Lakhssassi, A. (2021, June). A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 m CMOS for Industrial Sensor Interfaces [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Altoobaji, I., Ali, M., Hassan, A., Nabavi, M., Audet, Y., & Lakhssassi, A. (2020, August). A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation [Paper]. 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2020), Springfield, MA, USA. External link
Baratli, K., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (2013, June). A netlist pruning tool for an electronic system prototyping platform [Paper]. 11th IEEE International New Circuits and Systems Conference (NEWCAS 2013), Paris, France. External link
Berriah, O., Bougataya, M., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (2010, June). Thermal analysis of a miniature electronic power device matched to a silicon wafer [Paper]. 8th IEEE International NEWCAS Conference (NEWCAS 2010), Montréal, Québec. External link
Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquière, Y., Savaria, Y., Norman, R., & Prytula, R. (2010, December). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Paper]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. External link
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (2022, June). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Paper]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. External link
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (2021, June). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Available
Guillemot, M., Nguyen, H., Bougataya, M., Blaquière, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. In Novel Advances in Microsystems Technologies and Their Applications (pp. 67-100). External link
Lakhssassi, A., Palenychka, R., Savaria, Y., Saydé, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. External link
Lakhssassi, A., Palenychka, R., Sayde, M., Savaria, Y., Zaremba, M., & Kengne, E. (2013, September). A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera [Paper]. 8th International Symposium on Image and Signal Processing and Analysis (ISPA 2013), Trieste, Italy. External link
Nour, M., Gendreau, M., & Lakhssassi, A. (2018). Automatic laser interstitial thermal therapy for robot-assisted surgery. Global Journal of Advanced Engineering Technologies and Sciences, 5(3), 8-14. External link
Oukaira, A., Said, D., Touati, D. E., El-Zarif, N., Hassan, A., Savaria, Y., & Lakhssassi, A. (2024). Novel peak-source-scanning (NPSS) model for thermal control of systems-in-package (SiP). IEEE Access, 12, 14842-14853. Available
Oukaira, A., Savaria, Y., Boukadoum, M., & Lakhssassi, A. (2024, May). Advanced Simulation and Design Methodology of Josephson Traveling-Wave Parametric Amplifiers (JTWPA) for Quantum Electronics Applications [Paper]. 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET 2024), Fez, Morocco (5 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022, October). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Paper]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). External link
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). External link
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2021, August). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Paper]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. External link
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (2017, June). Hybrid features of tamura texture and shape-based image retrieval [Paper]. 5th International Conference on Advanced Computing, Networking, and Informatics (ICACNI 2017), Goa, India. External link
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (2018, July). Thermal image processing to Recognize and Quantify Pain in Human Body [Paper]. International Conference on Smart Computing and Electronic Enterprise (ICSCEE 2018), Shah Alam, Malaysia (5 pages). External link
Semmaoui, H., Drolet, J., Lakhssassi, A., & Sawan, M. (2010, December). A new approach for higher data reduction capacity based on spike detection technique in wireless multichannel neural recordings [Paper]. CIBEC 2010, Cairo, Egypt. External link
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal analysis of system in package considering boundary conditions for long-term reliability studies. IEEE Access, 12, 3396373 (12 pages). Available
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Available
