Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera

Ahmed Lakhssassi, Roman Palenychka, Yvon Savaria, Michel Saydé and Marek Zaremba

Article (2016)

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Department:	Department of Electrical Engineering
Research Center:	GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL:	https://publications.polymtl.ca/34886/
Journal Title:	IEEE Transactions on Circuits and Systems for Video Technology (vol. 26, no. 2)
Publisher:	IEEE
DOI:	10.1109/tcsvt.2015.2409632
Official URL:	https://doi.org/10.1109/tcsvt.2015.2409632
Date Deposited:	18 Apr 2023 15:05
Last Modified:	08 Apr 2025 06:56

Cite in APA 7:	Lakhssassi, A., Palenychka, R., Savaria, Y., Saydé, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. https://doi.org/10.1109/tcsvt.2015.2409632
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