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Lakhssassi, A., Palenychka, R., Savaria, Y., Sayde, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. Lien externe
Lakhssassi, A., Palenychka, R., Sayde, M., Savaria, Y., Zaremba, M., & Kengne, E. (septembre 2013). A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera [Communication écrite]. 8th International Symposium on Image and Signal Processing and Analysis (ISPA 2013), Trieste, Italy. Lien externe
