A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera

Ahmed Lakhssassi, Roman Palenychka, Michel Sayde, Yvon Savaria, Marek Zaremba and Emmanuel Kengne

Paper (2013)

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Department:	Department of Electrical Engineering
Research Center:	GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL:	https://publications.polymtl.ca/13629/
Conference Title:	8th International Symposium on Image and Signal Processing and Analysis (ISPA 2013)
Conference Location:	Trieste, Italy
Conference Date(s):	2013-09-04 - 2013-09-06
Publisher:	Institute of Electrical and Electronics Engineers
DOI:	10.1109/ispa.2013.6703733
Official URL:	https://doi.org/10.1109/ispa.2013.6703733
Date Deposited:	18 Apr 2023 15:09
Last Modified:	25 Sep 2024 15:50

Cite in APA 7:	Lakhssassi, A., Palenychka, R., Sayde, M., Savaria, Y., Zaremba, M., & Kengne, E. (2013, September). A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera [Paper]. 8th International Symposium on Image and Signal Processing and Analysis (ISPA 2013), Trieste, Italy. https://doi.org/10.1109/ispa.2013.6703733
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