Mohammed Bougataya, Oussama Berriah, Ahmed Lakhssassi, Adel-Omar Dahmane, Yves Blaquiere, Yvon Savaria
, Richard Norman and Richard Prytula
Paper (2010)
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| Department: | Department of Electrical Engineering |
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| Research Center: | GR2M - Microelectronics and Microsystems Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/41416/ |
| Conference Title: | 17th IEEE International Conference on Electronics, Circuits and Systems |
| Conference Location: | Athens, Greece |
| Conference Date(s): | 2010-12-12 - 2010-12-15 |
| Publisher: | IEEE |
| DOI: | 10.1109/icecs.2010.5724516 |
| Official URL: | https://doi.org/10.1109/icecs.2010.5724516 |
| Date Deposited: | 18 Apr 2023 15:13 |
| Last Modified: | 05 Apr 2024 11:38 |
| Cite in APA 7: | Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquiere, Y., Savaria, Y., Norman, R., & Prytula, R. (2010, December). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Paper]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. https://doi.org/10.1109/icecs.2010.5724516 |
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