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Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquiere, Y., Savaria, Y., Norman, R., & Prytula, R. (décembre 2010). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Communication écrite]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. Lien externe
Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquière, Y., & Savaria, Y. (mai 2008). Steady state thermal analysis of a reconfigurable wafer-scale circuit board [Communication écrite]. IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008), Niagara Falls, Ont.. Lien externe
Guillemot, M., Nguyen, H., Bougataya, M., Blaquiere, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. Dans Novel Advances in Microsystems Technologies and Their Applications (67-100). Lien externe
