 | Up a level |
Collaboration networkThis graph maps the connections between all the collaborators of {}'s publications listed on this page.
Each link represents a collaboration on the same publication. The thickness of the link represents the number of collaborations.
Use the mouse wheel or scroll gestures to zoom into the graph.
You can click on the nodes and links to highlight them and move the nodes by dragging them.
Hold down the "Ctrl" key or the "⌘" key while clicking on the nodes to open the list of this person's publications.
Word cloudA word cloud is a visual representation of the most frequently used words in a text or a set of texts. The words appear in different sizes, with the size of each word being proportional to its frequency of occurrence in the text. The more frequently a word is used, the larger it appears in the word cloud. This technique allows for a quick visualization of the most important themes and concepts in a text.
In the context of this page, the word cloud was generated from the publications of the author {}. The words in this cloud come from the titles, abstracts, and keywords of the author's articles and research papers. By analyzing this word cloud, you can get an overview of the most recurring and significant topics and research areas in the author's work.
The word cloud is a useful tool for identifying trends and main themes in a corpus of texts, thus facilitating the understanding and analysis of content in a visual and intuitive way.
Berriah, O., Bougataya, M., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (2010, June). Thermal analysis of a miniature electronic power device matched to a silicon wafer [Paper]. 8th IEEE International NEWCAS Conference (NEWCAS 2010), Montréal, Québec. External link
Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquière, Y., Savaria, Y., Norman, R., & Prytula, R. (2010, December). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Paper]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. External link
Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquière, Y., & Savaria, Y. (2008, May). Steady state thermal analysis of a reconfigurable wafer-scale circuit board [Paper]. IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008), Niagara Falls, Ont.. External link
Bougataya, M., Lakhasasi, A., Savaria, Y., & Massicotte, D. (2004, May). Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method [Paper]. 18th Annual Canadian Conference on Electrical and Computer Engineering (CCEC 2004), Niagara Falls, Ontario. External link
Bougataya, M., Lakhsasi, A., Savaria, Y., & Massicotte, D. (2003, January). Stress and distortion behavior for VLSI steady state thermal analysis [Paper]. Canadian Conference on Electrical and Computer Engineering (CCECE 2003). External link
Guillemot, M., Nguyen, H., Bougataya, M., Blaquière, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. In Novel Advances in Microsystems Technologies and Their Applications (pp. 67-100). External link
