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Items where Author is "Bougataya, Mohammed"

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Number of items: 6.

B

Berriah, O., Bougataya, M., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (2010, June). Thermal analysis of a miniature electronic power device matched to a silicon wafer [Paper]. 8th IEEE International NEWCAS Conference (NEWCAS 2010), Montréal, Québec. External link

Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquière, Y., Savaria, Y., Norman, R., & Prytula, R. (2010, December). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Paper]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. External link

Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquière, Y., & Savaria, Y. (2008, May). Steady state thermal analysis of a reconfigurable wafer-scale circuit board [Paper]. IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008), Niagara Falls, Ont.. External link

Bougataya, M., Lakhasasi, A., Savaria, Y., & Massicotte, D. (2004, May). Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method [Paper]. 18th Annual Canadian Conference on Electrical and Computer Engineering (CCEC 2004), Niagara Falls, Ontario. External link

Bougataya, M., Lakhsasi, A., Savaria, Y., & Massicotte, D. (2003, January). Stress and distortion behavior for VLSI steady state thermal analysis [Paper]. Canadian Conference on Electrical and Computer Engineering (CCECE 2003). External link

G

Guillemot, M., Nguyen, H., Bougataya, M., Blaquière, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. In Novel Advances in Microsystems Technologies and Their Applications (pp. 67-100). External link

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