Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method

Mohammed Bougataya, A. Lakhasasi, Yvon Savaria, Daniel Massicotte

Paper (2004)

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Department:
Department of Electrical Engineering
PolyPublie URL:
https://publications.polymtl.ca/25253/
Conference Title:
18th Annual Canadian Conference on Electrical and Computer Engineering (CCEC 2004)
Conference Location:
Niagara Falls, Ontario
Conference Date(s):
2004-05-02 - 2004-05-05
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ccece.2004.1345075
Official URL:
https://doi.org/10.1109/ccece.2004.1345075
OAI:
oai:publications.polymtl.ca:25253
ORCID
Date Deposited:
18 Apr 2023 15:19
Last Modified:
08 Oct 2026 17:26
Cite in APA 7:
Bougataya, M., Lakhasasi, A., Savaria, Y., & Massicotte, D. (2004, May). Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method [Paper]. 18th Annual Canadian Conference on Electrical and Computer Engineering (CCEC 2004), Niagara Falls, Ontario. https://doi.org/10.1109/ccece.2004.1345075

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