Mohammed Bougataya, Ahmed Lakhsasi, Richard Norman, Richard Prytula, Yves Blaquière and Yvon Savaria
Paper (2008)
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| Department: | Department of Electrical Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/21054/ |
| Conference Title: | IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008) |
| Conference Location: | Niagara Falls, Ont. |
| Conference Date(s): | 2008-05-04 - 2008-05-07 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| DOI: | 10.1109/ccece.2008.4564567 |
| Official URL: | https://doi.org/10.1109/ccece.2008.4564567 |
| Date Deposited: | 18 Apr 2023 15:15 |
| Last Modified: | 08 Apr 2025 02:08 |
| Cite in APA 7: | Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquière, Y., & Savaria, Y. (2008, May). Steady state thermal analysis of a reconfigurable wafer-scale circuit board [Paper]. IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008), Niagara Falls, Ont.. https://doi.org/10.1109/ccece.2008.4564567 |
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