Naresh Pal, Aravind Kilaru, Yvon Savaria
and Ahmed Lakhssassi
Paper (2018)
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| Department: | Department of Electrical Engineering |
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| Research Center: | GR2M - Microelectronics and Microsystems Research Group |
| ISBN: | 9781538648360 |
| PolyPublie URL: | https://publications.polymtl.ca/42215/ |
| Conference Title: | International Conference on Smart Computing and Electronic Enterprise (ICSCEE 2018) |
| Conference Location: | Shah Alam, Malaysia |
| Conference Date(s): | 2018-07-11 - 2018-07-12 |
| Publisher: | IEEE |
| DOI: | 10.1109/icscee.2018.8538368 |
| Official URL: | https://doi.org/10.1109/icscee.2018.8538368 |
| Date Deposited: | 18 Apr 2023 15:03 |
| Last Modified: | 08 Apr 2025 12:22 |
| Cite in APA 7: | Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (2018, July). Thermal image processing to Recognize and Quantify Pain in Human Body [Paper]. International Conference on Smart Computing and Electronic Enterprise (ICSCEE 2018), Shah Alam, Malaysia (5 pages). https://doi.org/10.1109/icscee.2018.8538368 |
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