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Oukaira, A., Savaria, Y., Boukadoum, M., & Lakhssassi, A. (mai 2024). Advanced Simulation and Design Methodology of Josephson Traveling-Wave Parametric Amplifiers (JTWPA) for Quantum Electronics Applications [Communication écrite]. 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET 2024), Fez, Morocco (5 pages). Lien externe
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies. IEEE Access, 12, 3396373 (12 pages). Lien externe
Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Lakhssassi, A., & Savaria, Y. (2023). Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors. Electronics, 12(13), 18 pages. Disponible
Altoobaji, I., Hassan, A., Ali, M., Nabavi, M., Audet, Y., & Lakhssassi, A. (2023). A Fully Integrated 0.6 Gbps Data Communication System for Inductive-Based Digital Isolator with 0.8 ns Propagation Delay and 10(-15) BER. Electronics, 12(15), 3336 (15 pages). Lien externe
Altoobaji, I., Hassan, A., Ali, M., Audet, Y., & Lakhssassi, A. (2023). A Low-Power 0.68-Gbps Data Communication System for Capacitive Digital Isolator With 1.9-ns Propagation Delay. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 5 pages. Lien externe
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (octobre 2022). FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips [Communication écrite]. 8th International Conference on Optimization and Applications (ICOA 2022), Genoa, Italy (4 pages). Lien externe
El-Zarif, N., Ali, M., Amer, M., Hassan, A., Oukaira, A., Lakhssassi, A., Fayomi, C. J. B., & Savaria, Y. (juin 2022). Investigation of Different Integrated Temperature Monitoring Sensors for High-Voltage SoC DC-DC Converters [Communication écrite]. 20th IEEE International Interregional NEWCAS Conference (NEWCAS 2022), Quebec City, QC, Canada. Lien externe
Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2022). Towards real-time monitoring of thermal peaks in systems-on-chip (SoC). Sensors, 22(15), 5904 (12 pages). Lien externe
Eddine, T. D., Oukaira, A., Hassan, A., Savaria, Y., & Lakhssassi, A. (juin 2021). Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Altoobaji, I., Ali, M., Hassan, A., Audet, Y., & Lakhssassi, A. (juin 2021). A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 m CMOS for Industrial Sensor Interfaces [Communication écrite]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). Lien externe
Oukaira, A., Touati, D. E., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (août 2021). Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs) [Communication écrite]. IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2021), Lansing, MI, USA. Lien externe
Ettahri, O., Oukaira, A., Ali, M., Hassan, A., Nabavi, M., Savaria, Y., & Lakhssassi, A. (2020). A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces. Sensors, 20(19), 5657 (16 pages). Disponible
Altoobaji, I., Ali, M., Hassan, A., Nabavi, M., Audet, Y., & Lakhssassi, A. (août 2020). A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation [Communication écrite]. 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2020), Springfield, MA, USA. Lien externe
Nour, M., Gendreau, M., & Lakhssassi, A. (2018). Automatic laser interstitial thermal therapy for robot-assisted surgery. Global Journal of Advanced Engineering Technologies and Sciences, 5(3), 8-14. Lien externe
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (juin 2017). Hybrid features of tamura texture and shape-based image retrieval [Communication écrite]. 5th International Conference on Advanced Computing, Networking, and Informatics (ICACNI 2017), Goa, India. Lien externe
Pal, N., Kilaru, A., Savaria, Y., & Lakhssassi, A. (juillet 2018). Thermal image processing to Recognize and Quantify Pain in Human Body [Communication écrite]. International Conference on Smart Computing and Electronic Enterprise (ICSCEE 2018), Shah Alam, Malaysia (5 pages). Lien externe
Lakhssassi, A., Palenychka, R., Savaria, Y., Sayde, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. Lien externe
Guillemot, M., Nguyen, H., Bougataya, M., Blaquiere, Y., Lakhssassi, A., Shields, M., & Savaria, Y. (2016). Wafer-scale rapid electronic systems prototyping platform: User support tools and thermo-mechanical validation. Dans Novel Advances in Microsystems Technologies and Their Applications (p. 67-100). Lien externe
Baratli, K., Lakhssassi, A., Blaquière, Y., & Savaria, Y. (juin 2013). A netlist pruning tool for an electronic system prototyping platform [Communication écrite]. 11th IEEE International New Circuits and Systems Conference (NEWCAS 2013), Paris, France. Lien externe
Lakhssassi, A., Palenychka, R., Sayde, M., Savaria, Y., Zaremba, M., & Kengne, E. (septembre 2013). A spatiotemporal attention operator for monitoring thermo-mechanical stress in wafer-scale integrated circuits using an infrared camera [Communication écrite]. 8th International Symposium on Image and Signal Processing and Analysis (ISPA 2013), Trieste, Italy. Lien externe
Bougataya, M., Berriah, O., Lakhssassi, A., Dahmane, A.-O., Blaquiere, Y., Savaria, Y., Norman, R., & Prytula, R. (décembre 2010). Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit [Communication écrite]. 17th IEEE International Conference on Electronics, Circuits and Systems, Athens, Greece. Lien externe
