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Popovici, D., & Meunier, M. (2001). Focusing Method and Apparatus for High-Resolution Projection Patterning. Review of Scientific Instruments, 72(2), 1435-1437. Lien externe
Popovici, D., Meunier, M., & Sacher, E. (1999). Laser-Enhanced Gas Phase Surface Modifications of Teflon AF1600 for Increased Copper Adhesion. Journal of Adhesion, 70(1-2), 155-166. Lien externe
Popovici, D., Piyakis, K., Meunier, M., & Sacher, E. (1998). Angle-resolved x-ray photoelectron spectroscopy comparison of copper/Teflon AF1600 and aluminum/Kapton metal diffusion. Journal of Applied Physics, 83(1), 108-111. Lien externe
Popovici, D., Czeremuzkin, G., Meunier, M., & Sacher, E. (1998). Laser-Induced Metal-Organic Chemical Vapor Deposition (MOCVD) of Cu(hfac)(TMVS) on Amorphous Teflon AF1600: an XPS Study of the Interface. Applied Surface Science, 126(3-4), 198-204. Lien externe
Popovici, D., Sacher, E., & Meunier, M. (1998). Photodegradation of Teflon AF1600 During XPS Analysis. Journal of Applied Polymer Science, 70(6), 1201-1207. Lien externe
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (1997). Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices. Microelectronic Engineering, 33(1-4), 217-221. Lien externe
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Alptekin, A., Martinu, L., Meunier, M., & Sacher, E. The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering [Communication écrite]. Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris). Lien externe
Popovici, D., Sacher, E., Meunier, M., Leonard, D., & Bertrand, P. Spontaneous reaction of Cu (hfac) (TMVS) vapor with Dupont Teflon AF1600 [Communication écrite]. Metallized plastics 5 & 6: fundamental and applied aspects. (5th conference held May 5-19, 1996 in Los Angeles and the 6th conference held Aug. 31-Sept. 5, 1997 in Paris). Lien externe
Popovici, D., Meunier, M., & Sacher, E. (janvier 1998). Surface modification of teflon AF1600 for enhanced adhesion [Communication écrite]. 21st Annual Meeting of the Adhesion Society. Non disponible
Popovici, D., Meunier, M., & Sacher, E. (mai 1997). Copper/teflon AF1600 interface interactions for multilevel interconnect applications [Communication écrite]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Non disponible
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (juin 1996). Proceedings of the 1996 E-MRS Spring Conference [Communication écrite]. E-MRS Spring Conference, Strasbourg, Fr. Lien externe
Czeremuszkin, G., Martinu, L., Alptekin, A., Popovici, D., & Sacher, E. (mai 1997). Thermal stability of low permittivity fluoropolymer dielectrics [Communication écrite]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Non disponible
Popovici, D., Sacher, E., Meunier, M., Martinu, L., Léonard, D., & Bertrand, P. (janvier 1996). Spontaneous reaction of Cu(hfac) (TMVS) vapor with DuPont teflon AF1600 [Communication écrite]. Electrochemical Society Annual Meeting. Non disponible
Popovici, D., Piyakis, K., Sacher, E., & Meunier, M. (novembre 1995). Terraced copper growth deposited onto Teflon AF1600 by the excimer laser irradiation of Cu(hfac) TMVS [Communication écrite]. MRS Fall Symposium, Boston, MA, USA. Lien externe
