Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices

D. Popovici, Jolanta-Ewa Sapieha, G. Czeremuszkin, Edward Sacher, Michel Meunier and Ludvik Martinu

Article (1997)

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Department:	Department of Engineering Physics
PolyPublie URL:	https://publications.polymtl.ca/30136/
Journal Title:	Microelectronic Engineering (vol. 33, no. 1-4)
Publisher:	Elsevier
DOI:	10.1016/s0167-9317(96)00048-2
Official URL:	https://doi.org/10.1016/s0167-9317%2896%2900048-2
Date Deposited:	18 Apr 2023 15:23
Last Modified:	08 Apr 2025 02:20

Cite in APA 7:	Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (1997). Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices. Microelectronic Engineering, 33(1-4), 217-221. https://doi.org/10.1016/s0167-9317%2896%2900048-2
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