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Czeremuszkin, G., Martinu, L., Alptekin, A., Popovici, D., & Sacher, E. (1997, May). Thermal stability of low permittivity fluoropolymer dielectrics [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Unavailable
Popovici, D., & Meunier, M. (2001). Focusing Method and Apparatus for High-Resolution Projection Patterning. Review of Scientific Instruments, 72(2), 1435-1437. External link
Popovici, D., Meunier, M., & Sacher, E. (1999). Laser-Enhanced Gas Phase Surface Modifications of Teflon AF1600 for Increased Copper Adhesion. Journal of Adhesion, 70(1-2), 155-166. External link
Popovici, D., Piyakis, K., Meunier, M., & Sacher, E. (1998). Angle-resolved x-ray photoelectron spectroscopy comparison of copper/Teflon AF1600 and aluminum/Kapton metal diffusion. Journal of Applied Physics, 83(1), 108-111. External link
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Alptekin, A., Martinu, L., Meunier, M., & Sacher, E. The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering [Paper]. Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris). External link
Popovici, D., Czeremuzkin, G., Meunier, M., & Sacher, E. (1998). Laser-Induced Metal-Organic Chemical Vapor Deposition (MOCVD) of Cu(hfac)(TMVS) on Amorphous Teflon AF1600: an XPS Study of the Interface. Applied Surface Science, 126(3-4), 198-204. External link
Popovici, D., Sacher, E., & Meunier, M. (1998). Photodegradation of Teflon AF1600 During XPS Analysis. Journal of Applied Polymer Science, 70(6), 1201-1207. External link
Popovici, D., Sacher, E., Meunier, M., Leonard, D., & Bertrand, P. Spontaneous reaction of Cu (hfac) (TMVS) vapor with Dupont Teflon AF1600 [Paper]. Metallized plastics 5 & 6: fundamental and applied aspects. (5th conference held May 5-19, 1996 in Los Angeles and the 6th conference held Aug. 31-Sept. 5, 1997 in Paris). External link
Popovici, D., Meunier, M., & Sacher, E. (1998, January). Surface modification of teflon AF1600 for enhanced adhesion [Paper]. 21st Annual Meeting of the Adhesion Society. Unavailable
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (1997). Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices. Microelectronic Engineering, 33(1-4), 217-221. External link
Popovici, D., Meunier, M., & Sacher, E. (1997, May). Copper/teflon AF1600 interface interactions for multilevel interconnect applications [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Unavailable
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (1996, June). Proceedings of the 1996 E-MRS Spring Conference [Paper]. E-MRS Spring Conference, Strasbourg, Fr. External link
Popovici, D., Sacher, E., Meunier, M., Martinu, L., Léonard, D., & Bertrand, P. (1996, January). Spontaneous reaction of Cu(hfac) (TMVS) vapor with DuPont teflon AF1600 [Paper]. Electrochemical Society Annual Meeting. Unavailable
Popovici, D., Piyakis, K., Sacher, E., & Meunier, M. (1995, November). Terraced copper growth deposited onto Teflon AF1600 by the excimer laser irradiation of Cu(hfac) TMVS [Paper]. MRS Fall Symposium, Boston, MA, USA. External link
