D. Popovici, Michel Meunier
and Edward Sacher
Paper (1997)
This item is not archived in PolyPublie
| Department: | Department of Engineering Physics |
|---|---|
| PolyPublie URL: | https://publications.polymtl.ca/30135/ |
| Conference Title: | 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues |
| Conference Location: | Montréal, Québec |
| Conference Date(s): | 1997-05-04 - 1997-05-09 |
| Publisher: | Electrochem. Soc Pennington |
| Date Deposited: | 18 Apr 2023 15:23 |
| Last Modified: | 25 Sep 2024 16:11 |
| Cite in APA 7: | Popovici, D., Meunier, M., & Sacher, E. (1997, May). Copper/teflon AF1600 interface interactions for multilevel interconnect applications [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. |
|---|---|
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