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Copper/teflon AF1600 interface interactions for multilevel interconnect applications

D. Popovici, Michel Meunier and Edward Sacher

Paper (1997)

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Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/30135/
Conference Title: 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues
Conference Location: Montréal, Québec
Conference Date(s): 1997-05-04 - 1997-05-09
Publisher: Electrochem. Soc Pennington
Date Deposited: 18 Apr 2023 15:23
Last Modified: 05 Apr 2024 11:19
Cite in APA 7: Popovici, D., Meunier, M., & Sacher, E. (1997, May). Copper/teflon AF1600 interface interactions for multilevel interconnect applications [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec.

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