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Caron, M., Gagnon, G., Gauvin, R., Hovington, P., Drouin, D., Currie, J. F., Tremblay, Y., Ouellet, L., Bigerger, M., & Wong, F. (juin 1996). An iterative procedure based on Monte Carlo simulation to determine the thickness and composition of VLSI metallization [Communication écrite]. 13th International VLSI Multilevel Interconnection (V-MIC) Conference, Santa Clara, CA, USA. Non disponible
Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Fortin, V., Tremblay, Y., Oueller, L., Wang, M., Biberger, M., & Wong, F. (juin 1996). Effect of a TiN anti-reflecting coating on the performance of Ti/TiN/AlSiCu metallization of VLSI devices [Communication écrite]. 13th International VLSI Multilevel Interconnection (V-MIC) Conference, Santa Clara, CA, USA. Non disponible
Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Fortin, V., Tremblay, Y., Ouellet, L., Wang, M., Biberger, M., & Wong, F. (juin 1996). Effect of the oxidation of TiN barrier on its efficiency as a diffusion barrier in AlSiCu metallization of VLSI devices [Communication écrite]. 13th International VLSI Multilevel Interconnection (V-MIC) Conference, Santa Clara, CA, USA. Non disponible
Gagnon, G., Gujrathi, S. C., Caron, M., Currie, J. F., Tremblay, Y., Ouellet, L., Biberger, M., & Reynolds, R. (1996). Effect of the oxidation of TiN on the stability of the Al/TiN interface. Journal of Applied Physics, 80(1), 188-195. Lien externe
Lang, T., Caron, M., Izquierdo, R., Ivanov, D., Currie, J. F., & Yelon, A. (1996). Material characterization of sputtered sodium-ion conductive ceramics for a prototype CO₂ micro-sensor. Sensors and Actuators. B, Chemical, 31(1-2), 9-12. Lien externe
Lecours, A., Caron, M., Ciureanu, P., Turcotte, G., Ivanov, D., Yelon, A., & Currie, J. F. (1996). Laser patterning of thin-film electrochemical gas sensors. Applied Surface Science, 96-98, 341-346. Lien externe
Ouellet, L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., & Biberger, M. (1996). The effect of the Ti glue layer in an integrated Ti/TiN/Ti/AlSiCu/TiN contact metallization process. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 2627-2635. Lien externe
Ouellet, L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., & Biberger, M. (1996). Effect of the Ti/TiN bilayer barrier and its surface treatment on the reliability of a Ti/TiN/AlSiCu/TiN contact metallization. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 3502-3508. Lien externe
Ouellet, O. L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Biberger, M., & Reynolds, R. (1996). The effect of an oxygen plasma exposure on the reliability of a ti/tin contact metallization. Journal of Applied Physics, 79(8, pt. 1), 4438-4443. Lien externe
