<  Back to the Polytechnique Montréal portal

The effect of the Ti glue layer in an integrated Ti/TiN/Ti/AlSiCu/TiN contact metallization process

L. Ouellet, Y. Tremblay, Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi and M. Biberger

Article (1996)

An external link is available for this item
Additional Information: Nom historique du département: Département de métallurgie et de génie des matériaux
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/30998/
Journal Title: Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena (vol. 14, no. 4)
Publisher: American Vacuum Society
DOI: 10.1116/1.588997
Official URL: https://doi.org/10.1116/1.588997
Date Deposited: 18 Apr 2023 15:24
Last Modified: 05 Apr 2024 11:20
Cite in APA 7: Ouellet, L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., & Biberger, M. (1996). The effect of the Ti glue layer in an integrated Ti/TiN/Ti/AlSiCu/TiN contact metallization process. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 2627-2635. https://doi.org/10.1116/1.588997

Statistics

Dimensions

Repository Staff Only

View Item View Item