L. Ouellet, Y. Tremblay, Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi and M. Biberger
Article (1996)
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| Additional Information: | Nom historique du département: Département de métallurgie et de génie des matériaux |
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| Department: | Department of Engineering Physics |
| Research Center: | GCM - Thin Film Physics and Technology Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/30998/ |
| Journal Title: | Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena (vol. 14, no. 4) |
| Publisher: | American Vacuum Society |
| DOI: | 10.1116/1.588997 |
| Official URL: | https://doi.org/10.1116/1.588997 |
| Date Deposited: | 18 Apr 2023 15:24 |
| Last Modified: | 25 Sep 2024 16:12 |
| Cite in APA 7: | Ouellet, L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., & Biberger, M. (1996). The effect of the Ti glue layer in an integrated Ti/TiN/Ti/AlSiCu/TiN contact metallization process. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 2627-2635. https://doi.org/10.1116/1.588997 |
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