<  Back to the Polytechnique Montréal portal

Effect of a TiN anti-reflecting coating on the performance of Ti/TiN/AlSiCu metallization of VLSI devices

Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi, V. Fortin, Y. Tremblay, L. Oueller, M. Wang, M. Biberger and F. Wong

Paper (1996)

This item is not archived in PolyPublie
Additional Information: Nom historique du département: Département de métallurgie et de génie des matériaux
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/31312/
Conference Title: 13th International VLSI Multilevel Interconnection (V-MIC) Conference
Conference Location: Santa Clara, CA, USA
Conference Date(s): 1996-06-18 - 1996-06-20
Publisher: VMIC
Date Deposited: 18 Apr 2023 15:24
Last Modified: 05 Apr 2024 11:21
Cite in APA 7: Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Fortin, V., Tremblay, Y., Oueller, L., Wang, M., Biberger, M., & Wong, F. (1996, June). Effect of a TiN anti-reflecting coating on the performance of Ti/TiN/AlSiCu metallization of VLSI devices [Paper]. 13th International VLSI Multilevel Interconnection (V-MIC) Conference, Santa Clara, CA, USA.

Statistics

Stats are not available on this system.

Repository Staff Only

View Item View Item