Effect of a TiN anti-reflecting coating on the performance of Ti/TiN/AlSiCu metallization of VLSI devices

Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi, V. Fortin, Y. Tremblay, L. Oueller, M. Wang, M. Biberger, F. Wong

Paper (1996)

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Additional Information:
Nom historique du département: Département de métallurgie et de génie des matériaux
Conference Title:
13th International VLSI Multilevel Interconnection (V-MIC) Conference
Conference Location:
Santa Clara, CA, USA
Conference Date(s):
1996-06-18 - 1996-06-20
Publisher:
VMIC
OAI:
oai:publications.polymtl.ca:31312
ORCID
Date Deposited:
18 Apr 2023 15:24
Last Modified:
02 Oct 2026 22:56
Cite in APA 7:
Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Fortin, V., Tremblay, Y., Oueller, L., Wang, M., Biberger, M., & Wong, F. (1996, June). Effect of a TiN anti-reflecting coating on the performance of Ti/TiN/AlSiCu metallization of VLSI devices [Paper]. 13th International VLSI Multilevel Interconnection (V-MIC) Conference, Santa Clara, CA, USA.

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