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Effect of the Ti/TiN bilayer barrier and its surface treatment on the reliability of a Ti/TiN/AlSiCu/TiN contact metallization

L. Ouellet, Y. Tremblay, Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi and M. Biberger

Article (1996)

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Additional Information: Nom historique du département: Département de métallurgie et de génie des matériaux
Department: Department of Engineering Physics
Research Center: GCM - Thin Film Physics and Technology Research Group
PolyPublie URL: https://publications.polymtl.ca/30999/
Journal Title: Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena (vol. 14, no. 6)
Publisher: American Vacuum Society
DOI: 10.1116/1.588788
Official URL: https://doi.org/10.1116/1.588788
Date Deposited: 18 Apr 2023 15:24
Last Modified: 25 Sep 2024 16:12
Cite in APA 7: Ouellet, L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., & Biberger, M. (1996). Effect of the Ti/TiN bilayer barrier and its surface treatment on the reliability of a Ti/TiN/AlSiCu/TiN contact metallization. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 3502-3508. https://doi.org/10.1116/1.588788

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