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The effect of an oxygen plasma exposure on the reliability of a ti/tin contact metallization

O. L. Ouellet, Y. Tremblay, Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi, M. Biberger and R. Reynolds

Article (1996)

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Additional Information: Nom historique du département: Département de métallurgie et de génie des matériaux
Department: Department of Engineering Physics
Research Center: GCM - Thin Film Physics and Technology Research Group
PolyPublie URL: https://publications.polymtl.ca/30997/
Journal Title: Journal of Applied Physics (vol. 79, no. 8, pt. 1)
Publisher: American Institute of Physics
DOI: 10.1063/1.361753
Official URL: https://doi.org/10.1063/1.361753
Date Deposited: 18 Apr 2023 15:24
Last Modified: 25 Sep 2024 16:12
Cite in APA 7: Ouellet, O. L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Biberger, M., & Reynolds, R. (1996). The effect of an oxygen plasma exposure on the reliability of a ti/tin contact metallization. Journal of Applied Physics, 79(8, pt. 1), 4438-4443. https://doi.org/10.1063/1.361753

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