O. L. Ouellet, Y. Tremblay, Gérald Gagnon, M. Caron, John F. Currie, S. C. Gujrathi, M. Biberger and R. Reynolds
Article (1996)
An external link is available for this itemAdditional Information: | Nom historique du département: Département de métallurgie et de génie des matériaux |
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Department: | Department of Engineering Physics |
Research Center: | GCM - Thin Film Physics and Technology Research Group |
PolyPublie URL: | https://publications.polymtl.ca/30997/ |
Journal Title: | Journal of Applied Physics (vol. 79, no. 8, pt. 1) |
Publisher: | American Institute of Physics |
DOI: | 10.1063/1.361753 |
Official URL: | https://doi.org/10.1063/1.361753 |
Date Deposited: | 18 Apr 2023 15:24 |
Last Modified: | 25 Sep 2024 16:12 |
Cite in APA 7: | Ouellet, O. L., Tremblay, Y., Gagnon, G., Caron, M., Currie, J. F., Gujrathi, S. C., Biberger, M., & Reynolds, R. (1996). The effect of an oxygen plasma exposure on the reliability of a ti/tin contact metallization. Journal of Applied Physics, 79(8, pt. 1), 4438-4443. https://doi.org/10.1063/1.361753 |
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