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Documents dont l'auteur est "Tian, Fengshi"

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Nombre de documents: 13

C

Chen, J., Wu, H., Tian, F., Hou, Q., Lin, S., Yang, J., & Sawan, M. (mai 2024). A Low-Power Level-Crossing Analog-to-Spike Converter Intended for Neuromorphic Biomedical Applications [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2024), Singapore, Singapore. Lien externe

Chen, J., Wu, H., Eskandari, R., Liu, X., Lin, S., Hou, Q., Tian, F., Zou, W., Yang, J., & Sawan, M. (avril 2024). A Neuron-Inspired 0.0032mm2−1.38μW/Ch Wireless Implantable Neural Interface with Direct Multiplexing Front-End and Event-Driven Spike Detection and Transmission [Communication écrite]. IEEE Custom Integrated Circuits Conference (CICC 2024), Denver, CO, USA. Lien externe

F

Fang, C., Shen, Z., Tian, F., Yang, J., & Sawan, M. (mai 2025). An Area-Efficient and Bit-Width Configurable Carry-Save Adder Tree for Spiking Transformers [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2025), London, United Kingdom. Lien externe

Fang, C., Tian, F., Yang, J., & Sawan, M. (mai 2024). Accelerating BPTT-Based SNN Training with Sparsity-Aware and Pipelined Architecture [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2024), Singapore, Singapore. Lien externe

Fang, C., Shen, Z., Zhao, S., Wang, C., Tian, F., Yang, J., & Sawan, M. (avril 2024). A 0.078 pJ/SOP Unstructured Sparsity-Aware Spiking Attention/Convolution Processor with 3D Compute Array [Communication écrite]. IEEE Custom Integrated Circuits Conference (CICC 2024), Denver, CO, USA. Lien externe

Fang, C., Shen, Z., Wang, Z., Wang, C., Zhao, S., Tian, F., Yang, J., & Sawan, M. (2024). An Energy-Efficient Unstructured Sparsity-Aware Deep SNN Accelerator With 3-D Computation Array. IEEE Journal of Solid-State Circuits, 1-13. Lien externe

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Tian, F., Chen, J., Shao, K., Liu, Z., Zheng, J., Wu, H., Fang, C., Wang, X., Shen, Z., Dong, P., Yao, Y., Wang, X., Yang, J., Sawan, M., Tsui, C.-Y., & Cheng, K.-T. (avril 2025). E-NPU: A 34~126nJ/Class Event-Driven Adaptive Neural SoC with Signal-Dynamics-Aware Feature Clustering and Multi-Model In-Memory Inference/Training for Personalized Medical Wearables [Communication écrite]. IEEE Custom Integrated Circuits Conference (CICC 2025), Boston, MA, USA. Lien externe

Tian, F., Zheng, J., He, J., Chen, J., Wang, X., Fang, C., Yang, J., Sawan, M., Tsui, C.-Y., & Cheng, K.-T. (mai 2024). BOLS: A Bionic Sensor-direct On-chip Learning System with Direct-Feedback-Through-Time for Personalized Wearable Health Monitoring [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2024), Singapore, Singapore. Lien externe

Tian, F., Chen, J., Zheng, J., Wu, H., He, J., Wang, X., Fang, C., Yuan, Y., Yang, J., Sawan, M., Tsui, C.-Y., & Cheng, K.-T. (2024). BioPI: An Energy Efficient and Low-Latency Neuromorphic Pipelined System with Joint Design Optimizations of Sensor-Algorithm-Processor for Wearable Healthcare. IEEE transactions on circuits and systems for artificial intelligence., 1-17. Lien externe

Z

Zhao, S., Wang, S., Wang, Z., Fang, C., Tian, F., Chen, J., Fu, C., Yang, J., & Sawan, M. (2025). BoostViT: Booth-Serial Skipping and Tunable Scaling for Vision Transformers. IEEE Transactions on Circuits and Systems I Regular Papers, 12 pages. Lien externe

Zheng, J., Tian, F., Chen, J., Fang, C., Yao, Y., Yang, J., Sawan, M., Cheng, K.-T., & Tsui, C.-Y. (mai 2025). NeuroEye: A 54.59mW, 12200FPS Event-Driven Near-Sensor Eye-Tracking Processor with Pipelined Spatial-Temporal Spike-Streaming [Communication écrite]. IEEE International Symposium on Circuits and Systems (ISCAS 2025), London, United Kingdom. Lien externe

Zhao, S., Li, S., Wu, D., Tian, F., Yang, J., & Sawan, M. (2025). A Resource-Efficient Algorithm-Hardware Co-Design Towards Semi-Supervised Neurological Symptoms Prediction. IEEE Transactions on Instrumentation and Measurement, 74, 12 pages. Lien externe

Zhao, S., Wang, C., Fang, C., Tian, F., Yang, J., & Sawan, M. (2024). HybMED: A Hybrid Neural Network Training Processor with Multi-Sparsity Exploitation for Internet of Medical Things. IEEE Transactions on Biomedical Circuits and Systems, 18(5), 1178-1189. Lien externe

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