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Items where Author is "Chagnon, Dany"

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Number of items: 9.

Article

Chagnon, D., Pippel, E., Senz, S., & Moutanabbir, O. (2016). Metal Seed Loss Throughout the Nanowire Growth: Bulk Trapping and Surface Mass Transport. Journal of Physical Chemistry C, 120(5), 2932-2940. External link

Chagnon, D., Isik, D., Levesque, P. L., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014). Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding. Meeting abstracts, MA2014-02(34), 1741-1741. External link

Fournier-Lupien, J.-H., Chagnon, D., Lévesque, P., AlMutairi, A.A. A., Wirths, S., Pippel, E., Mussler, G., Hartmann, J.-M., Mantl, S., Buca, D., & Moutanabbir, O. (2014). In Situ Studies of Germanium-Tin and Silicon-Germanium-Tin Thermal Stability. ECS Meeting Abstracts, MA2014-02(35), 1846-1846. External link

Paper

Fournier-Lupien, J.-H., Chagnon, D., Levesque, P., AlMutairi, A.A. A., Wirths, S., Pippel, E., Mussler, G., Hartmann, J.-M., Mantl, S., Buca, D., & Moutanabbir, O. (2014, October). In situ studies of germanium-tin and silicon-germanium-tin thermal stability [Paper]. 6th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 2014 ECS and SMEQ Joint International Meeting, Cancun, Mexico. External link

Chagnon, D., Isik, D., Levesque, P., Lewis, F., Caza, M.-E., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014, July). Metal-assisted hermetic wafer-level packaging [Paper]. 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan. External link

Poster

Chagnon, D., Abboud, Z., & Moutanabbir, O. (2017, August). In situ monitoring of microstructure and phase changes of AuSn solders for hermetic wafer-level packaging [Poster]. 18th Canadian Semiconductor Science and Technology Conference (CSSTC 2017), Waterloo, Ont.. External link

Abstract

Abboud, Z., Chagnon, D., Assali, S., Fortin-Deschenes, M., Coia, C., & Moutanabbir, O. (2018, September). Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras [Abstract]. AiMES 2018 Meeting, Cancun, Mexico. Published in ECS Meeting Abstracts, MA2018-02(29). External link

Master's thesis

Chagnon, D. (2012). Anisotropie magnétique du La2NiMnO6 multiferroïque par magnétométrie statique et spectroscopie de résonance ferromagnétique [Master's thesis, École Polytechnique de Montréal]. Available

Ph.D. thesis

Chagnon, D. (2018). Encapsulation hermétique de microbolomètres pour caméras infrarouges : optimisation et études in situ de l'instabilité des interfaces [Ph.D. thesis, École Polytechnique de Montréal]. Available

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