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Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras

Zeinab Abboud, Dany Chagnon, Simone Assali, Matthieu Fortin-Deschenes, Cedrik Coia and Oussama Moutanabbir

Abstract (2018)

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Additional Information: No. MA2018-02 976
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/40281/
Conference Title: AiMES 2018 Meeting
Conference Location: Cancun, Mexico
Conference Date(s): 2018-09-30 - 2018-10-04
Journal Title: ECS Meeting Abstracts (vol. MA2018-02, no. 29)
Publisher: The Electrochemical Society
DOI: 10.1149/ma2018-02/29/976
Official URL: https://doi.org/10.1149/ma2018-02/29/976
Date Deposited: 18 Apr 2023 15:02
Last Modified: 05 Apr 2024 11:36
Cite in APA 7: Abboud, Z., Chagnon, D., Assali, S., Fortin-Deschenes, M., Coia, C., & Moutanabbir, O. (2018, September). Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras [Abstract]. AiMES 2018 Meeting, Cancun, Mexico. Published in ECS Meeting Abstracts, MA2018-02(29). https://doi.org/10.1149/ma2018-02/29/976

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