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Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding

Dany Chagnon, Dilek Isik, Pierre L. Levesque, François Lewis, Marie-Ève Caza, Xuan Tuan Le, Jean-Sébastien Poirier, Damien Michel, Ronan Larger and Oussama Moutanabbir

Article (2014)

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Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/55558/
Journal Title: Meeting abstracts (vol. MA2014-02, no. 34)
Publisher: Electrochemical Society
DOI: 10.1149/ma2014-02/34/1741
Official URL: https://doi.org/10.1149/ma2014-02/34/1741
Date Deposited: 19 Sep 2023 16:08
Last Modified: 05 Apr 2024 12:02
Cite in APA 7: Chagnon, D., Isik, D., Levesque, P. L., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014). Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding. Meeting abstracts, MA2014-02(34), 1741-1741. https://doi.org/10.1149/ma2014-02/34/1741

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