Dany Chagnon, Dilek Isik, Pierre L. Levesque, François Lewis, Marie-Ève Caza, Xuan Tuan Le, Jean-Sébastien Poirier, Damien Michel, Ronan Larger and Oussama Moutanabbir
Article (2014)
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| Department: | Department of Engineering Physics |
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| PolyPublie URL: | https://publications.polymtl.ca/55558/ |
| Journal Title: | Meeting abstracts (vol. MA2014-02, no. 34) |
| Publisher: | Electrochemical Society |
| DOI: | 10.1149/ma2014-02/34/1741 |
| Official URL: | https://doi.org/10.1149/ma2014-02/34/1741 |
| Date Deposited: | 19 Sep 2023 16:08 |
| Last Modified: | 25 Sep 2024 16:47 |
| Cite in APA 7: | Chagnon, D., Isik, D., Levesque, P. L., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014). Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding. Meeting abstracts, MA2014-02(34), 1741-1741. https://doi.org/10.1149/ma2014-02/34/1741 |
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