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Chagnon, D., Isik, D., Levesque, P. L., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014). Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding. Meeting abstracts, MA2014-02(34), 1741-1741. Lien externe
Vu, N. P., Duong, X. T., Ly, V. A., Nguyen, D. C., Tran, M. D., Phan, Q. T., Balazinski, M., Son, L. T., Zeb, G., & Le, X. T. (2018). Electroless nickel plating onto Plexiglas (R) through simple covalent grafting of vinylpyridine seed layer. Materials & Design, 144, 151-158. Lien externe
Zeb, G., Nguyen, T. D., Giang, T. P. L., & Le, X. T. (2024). Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO2 for High Aspect Ratio Through-Silicon Via Technology in 3D Integration. ACS Applied Electronic Materials, 00062 (8 pages). Lien externe
Zeb, G., Duong, T. L., Balazinski, M., & Le, X. T. (2021). Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro-/Nano-fabricated Devices. Advanced Engineering Materials, 23(2), 8 pages. Lien externe
