Electroless nickel plating onto Plexiglas (R) through simple covalent grafting of vinylpyridine seed layer

Ngoc Pi Vu, Xuan Truong Duong, Viet Anh Ly, Duy Cuong Nguyen, Minh Duc Tran, Quang The Phan, Marek Balazinski, Le Thanh Son, Gul Zeb and Xuan Tuan Le

Article (2018)

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Department:	Department of Mechanical Engineering
PolyPublie URL:	https://publications.polymtl.ca/40003/
Journal Title:	Materials & Design (vol. 144)
Publisher:	Elsevier
DOI:	10.1016/j.matdes.2018.02.027
Official URL:	https://doi.org/10.1016/j.matdes.2018.02.027
Date Deposited:	18 Apr 2023 15:03
Last Modified:	25 Sep 2024 16:25

Cite in APA 7:	Vu, N. P., Duong, X. T., Ly, V. A., Nguyen, D. C., Tran, M. D., Phan, Q. T., Balazinski, M., Son, L. T., Zeb, G., & Le, X. T. (2018). Electroless nickel plating onto Plexiglas (R) through simple covalent grafting of vinylpyridine seed layer. Materials & Design, 144, 151-158. https://doi.org/10.1016/j.matdes.2018.02.027
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