Electroless nickel plating onto Plexiglas (R) through simple covalent grafting of vinylpyridine seed layer

N. P. Vu, X. T. Duong, V. A. Ly, D. C. Nguyen, M. D. Tran, Q. T. Phan, Marek Balazinski, L. T. Son, G. Zeb and X. T. Le

Article (2018)

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Department:	Department of Mechanical Engineering
PolyPublie URL:	https://publications.polymtl.ca/40003/
Journal Title:	Materials & Design (vol. 144)
Publisher:	Elsevier
DOI:	10.1016/j.matdes.2018.02.027
Official URL:	https://doi.org/10.1016/j.matdes.2018.02.027
Date Deposited:	18 Apr 2023 15:03
Last Modified:	18 Apr 2023 15:03

Cite in APA 7:	Vu, N. P., Duong, X. T., Ly, V. A., Nguyen, D. C., Tran, M. D., Phan, Q. T., Balazinski, M., Son, L. T., Zeb, G., & Le, X. T. (2018). Electroless nickel plating onto Plexiglas (R) through simple covalent grafting of vinylpyridine seed layer. Materials & Design, 144, 151-158. https://doi.org/10.1016/j.matdes.2018.02.027
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