 | Up a level |
Collaboration networkThis graph maps the connections between all the collaborators of {}'s publications listed on this page.
Each link represents a collaboration on the same publication. The thickness of the link represents the number of collaborations.
Use the mouse wheel or scroll gestures to zoom into the graph.
You can click on the nodes and links to highlight them and move the nodes by dragging them.
Hold down the "Ctrl" key or the "⌘" key while clicking on the nodes to open the list of this person's publications.
Word cloudA word cloud is a visual representation of the most frequently used words in a text or a set of texts. The words appear in different sizes, with the size of each word being proportional to its frequency of occurrence in the text. The more frequently a word is used, the larger it appears in the word cloud. This technique allows for a quick visualization of the most important themes and concepts in a text.
In the context of this page, the word cloud was generated from the publications of the author {}. The words in this cloud come from the titles, abstracts, and keywords of the author's articles and research papers. By analyzing this word cloud, you can get an overview of the most recurring and significant topics and research areas in the author's work.
The word cloud is a useful tool for identifying trends and main themes in a corpus of texts, thus facilitating the understanding and analysis of content in a visual and intuitive way.
Chagnon, D. (2018). Encapsulation hermétique de microbolomètres pour caméras infrarouges : optimisation et études in situ de l'instabilité des interfaces [Ph.D. thesis, École Polytechnique de Montréal]. Available
Abboud, Z., Chagnon, D., Assali, S., Fortin-Deschenes, M., Coia, C., & Moutanabbir, O. (2018, September). Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras [Abstract]. AiMES 2018 Meeting, Cancun, Mexico. Published in ECS Meeting Abstracts, MA2018-02(29). External link
Chagnon, D., Abboud, Z., & Moutanabbir, O. (2017, August). In situ monitoring of microstructure and phase changes of AuSn solders for hermetic wafer-level packaging [Poster]. 18th Canadian Semiconductor Science and Technology Conference (CSSTC 2017), Waterloo, Ont.. External link
Chagnon, D., Pippel, E., Senz, S., & Moutanabbir, O. (2016). Metal Seed Loss Throughout the Nanowire Growth: Bulk Trapping and Surface Mass Transport. Journal of Physical Chemistry C, 120(5), 2932-2940. External link
Chagnon, D., Isik, D., Levesque, P. L., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014). Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding. Meeting abstracts, MA2014-02(34), 1741-1741. External link
Fournier-Lupien, J.-H., Chagnon, D., Levesque, P., AlMutairi, A.A. A., Wirths, S., Pippel, E., Mussler, G., Hartmann, J.-M., Mantl, S., Buca, D., & Moutanabbir, O. (2014, October). In situ studies of germanium-tin and silicon-germanium-tin thermal stability [Paper]. 6th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 2014 ECS and SMEQ Joint International Meeting, Cancun, Mexico. External link
Fournier-Lupien, J.-H., Chagnon, D., Lévesque, P., AlMutairi, A.A. A., Wirths, S., Pippel, E., Mussler, G., Hartmann, J.-M., Mantl, S., Buca, D., & Moutanabbir, O. (2014). In Situ Studies of Germanium-Tin and Silicon-Germanium-Tin Thermal Stability. ECS Meeting Abstracts, MA2014-02(35), 1846-1846. External link
Chagnon, D., Isik, D., Levesque, P., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014, July). Metal-assisted hermetic wafer-level packaging [Paper]. 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan. External link
Chagnon, D. (2012). Anisotropie magnétique du La2NiMnO6 multiferroïque par magnétométrie statique et spectroscopie de résonance ferromagnétique [Master's thesis, École Polytechnique de Montréal]. Available
