Dany Chagnon, Dilek Isik, Pierre Levesque, François Lewis, Marie-Ève Caza, Xuan Than Le, Jean-Sébastien Poirier, Damien Michel, Ronan Larger and Oussama Moutanabbir
Paper (2014)
An external link is available for this item
| Department: | Department of Engineering Physics |
|---|---|
| ISBN: | 9781479952601 |
| PolyPublie URL: | https://publications.polymtl.ca/12601/ |
| Conference Title: | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
| Conference Location: | Tokyo, Japan |
| Conference Date(s): | 2014-07-15 - 2014-07-16 |
| Publisher: | IEEE Computer Society |
| DOI: | 10.1109/ltb-3d.2014.6886197 |
| Official URL: | https://doi.org/10.1109/ltb-3d.2014.6886197 |
| Date Deposited: | 18 Apr 2023 15:07 |
| Last Modified: | 08 Apr 2025 12:20 |
| Cite in APA 7: | Chagnon, D., Isik, D., Levesque, P., Lewis, F., Caza, M.-È., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014, July). Metal-assisted hermetic wafer-level packaging [Paper]. 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan. https://doi.org/10.1109/ltb-3d.2014.6886197 |
|---|---|
Statistics
Dimensions
Repository Staff Only
|
View Item |
