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Metal-assisted hermetic wafer-level packaging

Dany Chagnon, Dilek Isik, Pierre Levesque, François Lewis, Marie-Eve Caza, Xuan Than Le, Jean-Sebastien Poirier, Damien Michel, Ronan Larger and Oussama Moutanabbir

Paper (2014)

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Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/12601/
Conference Title: 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Conference Location: Tokyo, Japan
Conference Date(s): 2014-07-15 - 2014-07-16
Publisher: IEEE Computer Society
DOI: 10.1109/ltb-3d.2014.6886197
Official URL: https://doi.org/10.1109/ltb-3d.2014.6886197
Date Deposited: 18 Apr 2023 15:07
Last Modified: 05 Apr 2024 10:52
Cite in APA 7: Chagnon, D., Isik, D., Levesque, P., Lewis, F., Caza, M.-E., Le, X. T., Poirier, J.-S., Michel, D., Larger, R., & Moutanabbir, O. (2014, July). Metal-assisted hermetic wafer-level packaging [Paper]. 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan. https://doi.org/10.1109/ltb-3d.2014.6886197

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