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Thermal analysis of system in package considering boundary conditions for long-term reliability studies

Djallel Eddine Touati, Aziz Oukaira, Ahmad Hassan, Mohamed Ali, Yvon Savaria et Ahmed Lakhssassi

Article de revue (2024)

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Abstract

This paper proposes an integrated Foster-based thermal network for a System in Package (SiP) that models thermal interaction between package layers to predict the transient temperature of junctions and interlayer compression in SiP. The critical factors contributing to impedance mismatch are detailed to ensure modeling accuracy. Important factors include the boundary conditions and the interface layer of the thermal material. With the help of the Finite Element Method (FEM) and data curve fitting, thermal parameters are derived and expressed as a function of boundary conditions. The proposed modeling method is demonstrated with 3D heterogeneous System in Package models implemented in Simulink for long-term temperature predictions. Predicted junction and interlayer temperatures show good accuracy, confirmed by reported results obtained by Finite Element Analysis (FEA). The importance of considering the boundary conditions and the materials used in the various interfaces is shown through simulation results. Neglecting one of these key factors, the predicted temperature differs by as much as 14.5 °C in the reported results. The proposed thermal network is consistent with FEA, while computing much faster and producing results that differ by no more than 0.5 °C, unlike previously reported models.

Mots clés

finite element analysis (FEA); finite element method (FEM); heat transfer and interaction; integrated circuits (ICs); system-in-package (SiP); thermal model

Sujet(s): 2500 Génie électrique et électronique > 2500 Génie électrique et électronique
Département: Département de génie électrique
Organismes subventionnaires: Polytechnique Montréal
Numéro de subvention: BS123456
URL de PolyPublie: https://publications.polymtl.ca/58534/
Titre de la revue: IEEE Access (vol. 12)
Maison d'édition: IEEE
DOI: 10.1109/access.2024.3396373
URL officielle: https://doi.org/10.1109/access.2024.3396373
Date du dépôt: 03 juin 2024 14:54
Dernière modification: 11 oct. 2024 18:52
Citer en APA 7: Touati, D. E., Oukaira, A., Hassan, A., Ali, M., Savaria, Y., & Lakhssassi, A. (2024). Thermal analysis of system in package considering boundary conditions for long-term reliability studies. IEEE Access, 12, 3396373 (12 pages). https://doi.org/10.1109/access.2024.3396373

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