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Fourmigue, A. (2014). Méthodes de calcul numérique pour la simulation thermique des circuits intégrés [Ph.D. thesis, École Polytechnique de Montréal]. Available
Fourmigue, A., Beltrame, G., & Nicolescu, G. (2014, March). Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias [Paper]. 17th Design, Automation and Test in Europe (DATE 2014), Dresden, Germany. External link
Fourmigue, A., Beltrame, G., & Nicolescu, G. (2013, March). Explicit transient thermal simulation of liquid-cooled 3D ICs [Paper]. 16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013), Grenoble, France. External link
Fourmigue, A., Girodias, B., Gheorghe, L., Nicolescu, G., & Aboulhamid, E. M. (2012). Wireless design platform combining simulation and testbed environments. In Design technology for heterogeneous embedded systems (pp. 137-156). External link
Fourmigue, A., Beltrame, G., Nicolescu, G., & Aboulhamid, E. M. (2011, October). A linear-time approach for the transient thermal simulation of liquid-cooled 3D ICs [Paper]. 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis (CODES+ISSS 2011), part of Embedded Systems Week (ESWEEK 2011), Taipei, Taiwan. External link
Fourmigue, A., Beltrame, G., Nicolescu, G., Aboulhamid, E. M., & O'Connor, I. (2011, March). Multi-granularity thermal evaluation of 3D MPSoC architectures [Paper]. 14th Design, Automation and Test in Europe Conference and Exhibition (DATE 2011), Grenoble, France. External link
Fourmigue, A., Girodias, B., Nicolescu, G., & Aboulhamid, E. M. (2009, April). Co-simulation based platform for wireless protocols design explorations [Paper]. Design, Automation and Test in Europe Conference and Exhibition (DATE 2009), Nice, France. External link
Hui, L., Fourmigue, A., Le Beux, S., Letartre, X., O'Connor, I., & Nicolescu, G. (2015, March). Thermal aware design method for VCSEL-based on-chip optical interconnect [Paper]. Design, Automation and Test in Europe Conference and Exhibition (DATE 2015), Grenoble, France. External link
Li, H., Fourmigue, A., Le Beux, S., O'Connor, I., & Nicolescu, G. (2016, March). A thermal-Aware Laser Tuning Approach for Silicon Photonic Interconnects [Paper]. 2nd International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS Workshop 2016), Dresden, Germany. Unavailable
Li, H., Fourmigue, A., Le Beux, S., O'Connor, I., & Nicolescu, G. (2016). Towards Maximum Energy Efficiency in Nanophotonic Interconnects with Thermal-Aware On-Chip Laser Tuning. IEEE Transactions on Emerging Topics in Computing, 6(3), 343-356. External link
