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Explicit transient thermal simulation of liquid-cooled 3D ICs

Alain Fourmigue, Giovanni Beltrame and Gabriela Nicolescu

Paper (2013)

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Department: Department of Computer Engineering and Software Engineering
Research Center: GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL: https://publications.polymtl.ca/13890/
Conference Title: 16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013)
Conference Location: Grenoble, France
Conference Date(s): 2013-03-18 - 2013-03-22
DOI: 10.7873/date.2013.283
Official URL: https://doi.org/10.7873/date.2013.283
Date Deposited: 18 Apr 2023 15:09
Last Modified: 05 Apr 2024 10:53
Cite in APA 7: Fourmigue, A., Beltrame, G., & Nicolescu, G. (2013, March). Explicit transient thermal simulation of liquid-cooled 3D ICs [Paper]. 16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013), Grenoble, France. https://doi.org/10.7873/date.2013.283

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