Explicit transient thermal simulation of liquid-cooled 3D ICs

Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu

Paper (2013)

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ISBN:
9783981537000
Conference Title:
16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013)
Conference Location:
Grenoble, France
Conference Date(s):
2013-03-18 - 2013-03-22
OAI:
oai:publications.polymtl.ca:13890
ORCID
Date Deposited:
18 Apr 2023 15:09
Last Modified:
08 Oct 2026 17:01
Cite in APA 7:
Fourmigue, A., Beltrame, G., & Nicolescu, G. (2013, March). Explicit transient thermal simulation of liquid-cooled 3D ICs [Paper]. 16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013), Grenoble, France. https://doi.org/10.7873/date.2013.283

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