Explicit transient thermal simulation of liquid-cooled 3D ICs

Alain Fourmigue, Giovanni Beltrame and Gabriela Nicolescu

Paper (2013)

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Department:	Department of Computer Engineering and Software Engineering
Research Center:	GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL:	https://publications.polymtl.ca/13890/
Conference Title:	16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013)
Conference Location:	Grenoble, France
Conference Date(s):	2013-03-18 - 2013-03-22
DOI:	10.7873/date.2013.283
Official URL:	https://doi.org/10.7873/date.2013.283
Date Deposited:	18 Apr 2023 15:09
Last Modified:	25 Sep 2024 15:51

Cite in APA 7:	Fourmigue, A., Beltrame, G., & Nicolescu, G. (2013, March). Explicit transient thermal simulation of liquid-cooled 3D ICs [Paper]. 16th Design, Automation and Test in Europe Conference and Exhibition (DATE 2013), Grenoble, France. https://doi.org/10.7873/date.2013.283
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