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A linear-time approach for the transient thermal simulation of liquid-cooled 3D ICs

Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu and El Mostapha Aboulhamid

Paper (2011)

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Department: Department of Computer Engineering and Software Engineering
Research Center: GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL: https://publications.polymtl.ca/16892/
Conference Title: 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis (CODES+ISSS 2011), part of Embedded Systems Week (ESWEEK 2011)
Conference Location: Taipei, Taiwan
Conference Date(s): 2011-10-09 - 2011-10-14
Publisher: Association for Computing Machinery
DOI: 10.1145/2039370.2039402
Official URL: https://doi.org/10.1145/2039370.2039402
Date Deposited: 18 Apr 2023 15:12
Last Modified: 05 Apr 2024 10:58
Cite in APA 7: Fourmigue, A., Beltrame, G., Nicolescu, G., & Aboulhamid, E. M. (2011, October). A linear-time approach for the transient thermal simulation of liquid-cooled 3D ICs [Paper]. 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis (CODES+ISSS 2011), part of Embedded Systems Week (ESWEEK 2011), Taipei, Taiwan. https://doi.org/10.1145/2039370.2039402

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