Alain Fourmigue, Giovanni Beltrame
, Gabriela Nicolescu and El Mostapha Aboulhamid
Paper (2011)
An external link is available for this item
| Department: | Department of Computer Engineering and Software Engineering |
|---|---|
| Research Center: | GR2M - Microelectronics and Microsystems Research Group |
| ISBN: | 9781450307154 |
| PolyPublie URL: | https://publications.polymtl.ca/16892/ |
| Conference Title: | 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis (CODES+ISSS 2011), part of Embedded Systems Week (ESWEEK 2011) |
| Conference Location: | Taipei, Taiwan |
| Conference Date(s): | 2011-10-09 - 2011-10-14 |
| Publisher: | Association for Computing Machinery |
| DOI: | 10.1145/2039370.2039402 |
| Official URL: | https://doi.org/10.1145/2039370.2039402 |
| Date Deposited: | 18 Apr 2023 15:12 |
| Last Modified: | 08 Apr 2025 12:19 |
| Cite in APA 7: | Fourmigue, A., Beltrame, G., Nicolescu, G., & Aboulhamid, E. M. (2011, October). A linear-time approach for the transient thermal simulation of liquid-cooled 3D ICs [Paper]. 9th IEEE/ACM International Conference on Hardware/Software-Codesign and System Synthesis (CODES+ISSS 2011), part of Embedded Systems Week (ESWEEK 2011), Taipei, Taiwan. https://doi.org/10.1145/2039370.2039402 |
|---|---|
Statistics
Dimensions
Repository Staff Only
|
View Item |
