Alain Fourmigue, Giovanni Beltrame
and Gabriela Nicolescu
Paper (2014)
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| Department: | Department of Computer Engineering and Software Engineering |
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| Research Center: | GR2M - Microelectronics and Microsystems Research Group |
| ISBN: | 9783981537024 |
| PolyPublie URL: | https://publications.polymtl.ca/12366/ |
| Conference Title: | 17th Design, Automation and Test in Europe (DATE 2014) |
| Conference Location: | Dresden, Germany |
| Conference Date(s): | 2014-03-24 - 2014-03-28 |
| DOI: | 10.7873/date2014.087 |
| Official URL: | https://doi.org/10.7873/date2014.087 |
| Date Deposited: | 18 Apr 2023 15:08 |
| Last Modified: | 19 Feb 2025 13:54 |
| Cite in APA 7: | Fourmigue, A., Beltrame, G., & Nicolescu, G. (2014, March). Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias [Paper]. 17th Design, Automation and Test in Europe (DATE 2014), Dresden, Germany. https://doi.org/10.7873/date2014.087 |
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