<  Back to the Polytechnique Montréal portal

Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias

Alain Fourmigue, Giovanni Beltrame and Gabriela Nicolescu

Paper (2014)

An external link is available for this item
Department: Department of Computer Engineering and Software Engineering
Research Center: GR2M - Microelectronics and Microsystems Research Group
PolyPublie URL: https://publications.polymtl.ca/12366/
Conference Title: 17th Design, Automation and Test in Europe (DATE 2014)
Conference Location: Dresden, Germany
Conference Date(s): 2014-03-24 - 2014-03-28
DOI: 10.7873/date2014.087
Official URL: https://doi.org/10.7873/date2014.087
Date Deposited: 18 Apr 2023 15:08
Last Modified: 05 Apr 2024 10:51
Cite in APA 7: Fourmigue, A., Beltrame, G., & Nicolescu, G. (2014, March). Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias [Paper]. 17th Design, Automation and Test in Europe (DATE 2014), Dresden, Germany. https://doi.org/10.7873/date2014.087

Statistics

Dimensions

Repository Staff Only

View Item View Item