Li Hui, Alain Fourmigue, Sébastien Le Beux, Xavier Letartre, Ian O'Connor and Gabriela Nicolescu
Paper (2015)
An external link is available for this itemDepartment: | Department of Computer Engineering and Software Engineering |
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ISBN: | 9783981537048 |
PolyPublie URL: | https://publications.polymtl.ca/11141/ |
Conference Title: | Design, Automation and Test in Europe Conference and Exhibition (DATE 2015) |
Conference Location: | Grenoble, France |
Conference Date(s): | 2015-03-09 - 2015-03-13 |
Publisher: | ACM |
DOI: | 10.7873/date.2015.0479 |
Official URL: | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&ar... |
Date Deposited: | 18 Apr 2023 15:07 |
Last Modified: | 25 Sep 2024 15:47 |
Cite in APA 7: | Hui, L., Fourmigue, A., Le Beux, S., Letartre, X., O'Connor, I., & Nicolescu, G. (2015, March). Thermal aware design method for VCSEL-based on-chip optical interconnect [Paper]. Design, Automation and Test in Europe Conference and Exhibition (DATE 2015), Grenoble, France. https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7092556 |
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