Li Hui, Alain Fourmigue, Sébastien Le Beux, Xavier Letartre, Ian O'Connor and Gabriela Nicolescu
Paper (2015)
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| Department: | Department of Computer Engineering and Software Engineering |
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| Funders: | China Scholarship Council (CSC) |
| ISBN: | 9783981537048 |
| PolyPublie URL: | https://publications.polymtl.ca/11141/ |
| Conference Title: | Design, Automation and Test in Europe Conference and Exhibition (DATE 2015) |
| Conference Location: | Grenoble, France |
| Conference Date(s): | 2015-03-09 - 2015-03-13 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| DOI: | 10.7873/date.2015.0479 |
| Official URL: | https://doi.org/10.7873/date.2015.0479 |
| Date Deposited: | 18 Apr 2023 15:07 |
| Last Modified: | 29 Aug 2025 16:56 |
| Cite in APA 7: | Hui, L., Fourmigue, A., Le Beux, S., Letartre, X., O'Connor, I., & Nicolescu, G. (2015, March). Thermal aware design method for VCSEL-based on-chip optical interconnect [Paper]. Design, Automation and Test in Europe Conference and Exhibition (DATE 2015), Grenoble, France. https://doi.org/10.7873/date.2015.0479 |
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