Cédrik Coia, C. Lavoie, F. M. D'Heurle, C. Detavernier, Patrick Desjardins
and A. J. Kellock
Paper (2005)
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| Additional Information: | 1091-8213 |
|---|---|
| Department: | Department of Engineering Physics |
| PolyPublie URL: | https://publications.polymtl.ca/24264/ |
| Conference Title: | 207th Meeting of the Electrochemical Society |
| Conference Location: | Québec, Canada |
| Conference Date(s): | 2005-05-15 - 2005-05-20 |
| Publisher: | Electrochemical Society |
| DOI: | 10.1149/ma2005-01/14/685 |
| Official URL: | https://doi.org/10.1149/ma2005-01/14/685 |
| Date Deposited: | 18 Apr 2023 15:18 |
| Last Modified: | 25 Sep 2024 16:04 |
| Cite in APA 7: | Coia, C., Lavoie, C., D'Heurle, F. M., Detavernier, C., Desjardins, P., & Kellock, A. J. (2005, May). Reactive diffusion in the Ni-Si system: Influence of Ni thickness on the phase formation sequence [Paper]. 207th Meeting of the Electrochemical Society, Québec, Canada. https://doi.org/10.1149/ma2005-01/14/685 |
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