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Reactive diffusion in the Ni-Si system: Influence of Ni thickness on the phase formation sequence

Cédrik Coia, C. Lavoie, F. M. D'Heurle, C. Detavernier, Patrick Desjardins and A. J. Kellock

Paper (2005)

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Additional Information: 1091-8213
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/24264/
Conference Title: 207th Meeting of the Electrochemical Society
Conference Location: Québec, Canada
Conference Date(s): 2005-05-15 - 2005-05-20
Publisher: Electrochemical Society
DOI: 10.1149/ma2005-01/14/685
Official URL: https://doi.org/10.1149/ma2005-01/14/685
Date Deposited: 18 Apr 2023 15:18
Last Modified: 05 Apr 2024 11:09
Cite in APA 7: Coia, C., Lavoie, C., D'Heurle, F. M., Detavernier, C., Desjardins, P., & Kellock, A. J. (2005, May). Reactive diffusion in the Ni-Si system: Influence of Ni thickness on the phase formation sequence [Paper]. 207th Meeting of the Electrochemical Society, Québec, Canada. https://doi.org/10.1149/ma2005-01/14/685

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