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Documents dont l'auteur est "Yang, D. Q."

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Nombre de documents: 8

J

José-Yacamán, M., Gutierrez-Wing, C., Miki, M., Yang, D. Q., Piyakis, K. N., & Sacher, E. (2005). Surface Diffusion and Coalescence of Mobile Metal Nanoparticles. Journal of Physical Chemistry B, 109(19), 9703-9711. Lien externe

P

Poulin, S., Yang, D. Q., Sacher, E., Hyett, C., & Ellis, T. H. (2000). The Surface Structure of Dow Cyclotene 3022, as Determined by Photoacoustic Ftir, Confocal Raman and Photoelectron Spectroscopies. Applied Surface Science, 165(1), 15-22. Lien externe

S

Sun, S. H., Yang, D. Q., Villers, D., Zhang, G. X., Sacher, E., & Dodelet, J. P. (2008). Template- and Surfactant-Free Room Temperature Synthesis of Self-Assembled 3d Pt Nanoflowers From Single-Crystal Nanowires. Advanced Materials, 20(3), 571-574. Lien externe

Sadough-Vanini, A., Yang, D. Q., Martinu, L., & Sacher, E. (2001). The Adhesion of Evaporated Copper to Dow Cyclotene 3022 (R), Determined by Microscratch Testing. Journal of Adhesion, 77(4), 309-321. Lien externe

Y

Yang, D. Q., & Sacher, E. (janvier 2006). The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved [Communication écrite]. 29th annual meeting of the adhesion society, Blacksburg, Va. Non disponible

Yang, D. Q., & Sacher, E. (janvier 2004). Adhesion enhancing chemical surface modification of low permittivity polymer by N2 plasma treatment and its effect on contact atomic force microscopic imaging [Communication écrite]. 27th annual meeting, Adhesion Society. Non disponible

Yang, D. Q., & Sacher, E. (janvier 2003). Nanostructure formation of copper clusters using contact mode AFM: dependence on cluster adhesion [Communication écrite]. 26th annual meeting of the adhesion society, Blacksburg, Virginia. Non disponible

Yang, D. Q., & Sacher, E. (2002). The Surface Modification of Dow Cyclotene by Low Energy N₂⁺ Beams and Its Effect on the Adhesion of Evaporated Cu Films. Applied Surface Science, 195(1-4), 202-213. Lien externe

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