The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved

D. Q. Yang and Edward Sacher

Paper (2006)

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Department:	Department of Engineering Physics
PolyPublie URL:	https://publications.polymtl.ca/22386/
Conference Title:	29th annual meeting of the adhesion society
Conference Location:	Blacksburg, Va
Conference Date(s):	2006-01-01 - 2006-12-31
Date Deposited:	18 Apr 2023 15:18
Last Modified:	25 Sep 2024 16:01

Cite in APA 7:	Yang, D. Q., & Sacher, E. (2006, January). The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved [Paper]. 29th annual meeting of the adhesion society, Blacksburg, Va.
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