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The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved

D. Q. Yang and Edward Sacher

Paper (2006)

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Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/22386/
Conference Title: 29th annual meeting of the adhesion society
Conference Location: Blacksburg, Va
Conference Date(s): 2006-01-01 - 2006-12-31
Date Deposited: 18 Apr 2023 15:18
Last Modified: 05 Apr 2024 11:06
Cite in APA 7: Yang, D. Q., & Sacher, E. (2006, January). The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved [Paper]. 29th annual meeting of the adhesion society, Blacksburg, Va.

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