A. Sadough-Vanini, D. Q. Yang, Ludvik Martinu
and Edward Sacher
Article (2001)
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| Department: | Department of Engineering Physics |
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| Research Center: | GCM - Thin Film Physics and Technology Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/27074/ |
| Journal Title: | Journal of Adhesion (vol. 77, no. 4) |
| Publisher: | Taylor & Francis |
| DOI: | 10.1080/00218460108030744 |
| Official URL: | https://doi.org/10.1080/00218460108030744 |
| Date Deposited: | 18 Apr 2023 15:21 |
| Last Modified: | 25 Sep 2024 16:07 |
| Cite in APA 7: | Sadough-Vanini, A., Yang, D. Q., Martinu, L., & Sacher, E. (2001). The Adhesion of Evaporated Copper to Dow Cyclotene 3022 (R), Determined by Microscratch Testing. Journal of Adhesion, 77(4), 309-321. https://doi.org/10.1080/00218460108030744 |
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