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The Adhesion of Evaporated Copper to Dow Cyclotene 3022 (R), Determined by Microscratch Testing

A. Sadough-Vanini, D. Q. Yang, Ludvik Martinu and Edward Sacher

Article (2001)

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Department: Department of Engineering Physics
Research Center: GCM - Thin Film Physics and Technology Research Group
PolyPublie URL: https://publications.polymtl.ca/27074/
Journal Title: Journal of Adhesion (vol. 77, no. 4)
Publisher: Taylor & Francis
DOI: 10.1080/00218460108030744
Official URL: https://doi.org/10.1080/00218460108030744
Date Deposited: 18 Apr 2023 15:21
Last Modified: 05 Apr 2024 11:14
Cite in APA 7: Sadough-Vanini, A., Yang, D. Q., Martinu, L., & Sacher, E. (2001). The Adhesion of Evaporated Copper to Dow Cyclotene 3022 (R), Determined by Microscratch Testing. Journal of Adhesion, 77(4), 309-321. https://doi.org/10.1080/00218460108030744

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