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Documents dont l'auteur est "Ding, Yan"

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Nombre de documents: 11

Ding, Y., & Wu, K. (juin 2012). SIW varactor-tuned phase shifter and phase modulator [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2012), Montréal, QC, Canada. Lien externe

Ding, Y. (2011). Miniaturization Techniques of Substrate Integrated Waveguide Based on Multilayered Printed Circuit Board Platform [Thèse de doctorat, École Polytechnique de Montréal]. Disponible

Ding, Y., Kwark, Y. H., Shan, L., Baks, C., & Wu, K. (mai 2011). Techniques for de-embedding a high port count connector to PCB via interposer [Communication écrite]. 61st Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL, United states. Lien externe

Ding, Y., & Wu, K. (juin 2011). Varactor-tuned substrate integrated waveguide phase shifter [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2011), Baltimore, MD, United states. Lien externe

Ding, Y., & Wu, K. (2010). T-Type Folded Substrate Integrated Waveguide (TFSIW) Slot Array Antenna. IEEE Transactions on Antennas and Propagation, 58(5), 1792-1795. Lien externe

Ding, Y., & Wu, K. (2009). A 4 x 4 ridge substrate integrated waveguide (RSIW) slot array antenna. IEEE Antennas and Wireless Propagation Letters, 8, 561-564. Lien externe

Ding, Y., & Wu, K. (juin 2009). Miniaturized hybrid ring circuits using T-type folded substrate integrated waveguide (TFSIW) [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2009), Boston, MA. Lien externe

Ding, Y., & Wu, K. (juin 2008). Half-mode substrate integrated waveguide six-port front-end circuits for direct-conversion transceiver design [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2008), Atlanta, GA, USA. Lien externe

Ding, Y., & Wu, K. (décembre 2008). Miniaturization Techniques of Substrate Integrated Waveguide Circuits [Communication écrite]. IEEE MTT-S International Microwave Workshop Series on Art of Miniaturizing RF and Microwave Passive Components (IMWS 2008), Chengdu, China. Lien externe

Ding, Y., & Wu, K. (juin 2007). Substrate integrated waveguide-to-microstrip transition in multilayer substrate [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2007), Honolulu, HI, United States. Lien externe

Ding, Y., & Wu, K. (2007). Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate. IEEE Transactions on Microwave Theory and Techniques, 55(12), 2839-2844. Lien externe

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