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Techniques for de-embedding a high port count connector to PCB via interposer

Yan Ding, Young H. Kwark, Lei Shan, Christian Baks and Ke Wu

Paper (2011)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/16981/
Conference Title: 61st Electronic Components and Technology Conference (ECTC 2011)
Conference Location: Lake Buena Vista, FL, United states
Conference Date(s): 2011-05-31 - 2011-06-03
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ectc.2011.5898552
Official URL: https://doi.org/10.1109/ectc.2011.5898552
Date Deposited: 18 Apr 2023 15:12
Last Modified: 05 Apr 2024 10:58
Cite in APA 7: Ding, Y., Kwark, Y. H., Shan, L., Baks, C., & Wu, K. (2011, May). Techniques for de-embedding a high port count connector to PCB via interposer [Paper]. 61st Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL, United states. https://doi.org/10.1109/ectc.2011.5898552

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