Yan Ding, Young H. Kwark, Lei Shan, Christian Baks and Ke Wu
Paper (2011)
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| Department: | Department of Electrical Engineering |
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| Research Center: | POLY-GRAMES - Advanced Research Centre in Microwaves and Space Electronics |
| ISBN: | 9781612844978 |
| PolyPublie URL: | https://publications.polymtl.ca/16981/ |
| Conference Title: | 61st Electronic Components and Technology Conference (ECTC 2011) |
| Conference Location: | Lake Buena Vista, FL, United states |
| Conference Date(s): | 2011-05-31 - 2011-06-03 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| DOI: | 10.1109/ectc.2011.5898552 |
| Official URL: | https://doi.org/10.1109/ectc.2011.5898552 |
| Date Deposited: | 18 Apr 2023 15:12 |
| Last Modified: | 25 Sep 2024 15:54 |
| Cite in APA 7: | Ding, Y., Kwark, Y. H., Shan, L., Baks, C., & Wu, K. (2011, May). Techniques for de-embedding a high port count connector to PCB via interposer [Paper]. 61st Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL, United states. https://doi.org/10.1109/ectc.2011.5898552 |
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