Master's thesis (2003)
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Open Access to the full text of this document Published Version Terms of Use: All rights reserved Download (49MB) |
| Additional Information: | Le fichier PDF de ce document a été produit par Bibliothèque et Archives Canada selon les termes du programme Thèses Canada https://canada.on.worldcat.org/oclc/67855689 |
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| Department: | Department of Electrical Engineering |
| Academic/Research Directors: |
Yvon Savaria and Chunyan Wang
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| ISBN: | 0612979644; 9780612979642 |
| PolyPublie URL: | https://publications.polymtl.ca/7498/ |
| Institution: | École Polytechnique de Montréal |
| Date Deposited: | 04 Aug 2021 11:05 |
| Last Modified: | 27 Sep 2024 12:06 |
| Cite in APA 7: | Lu, M. (2003). Defect tolerance methods and thermally induced skew analysis for wafer scale integration [Master's thesis, École Polytechnique de Montréal]. PolyPublie. https://publications.polymtl.ca/7498/ |
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