Electronics and Packaging Intended for Emerging Harsh Environment Applications: A Review

Several industrial applications require specific electronic systems installed in harsh environments to perform measurements, monitoring, and control tasks such as in space exploration, aerospace missions, automotive industries, down-hole oil and gas industry, and geothermal power plants. The extreme environment could be surrounding high-, low-, and wide-range temperature, intense radiation, or even a combination of above conditions. We review, in this paper, the main leading applications that demand advanced technologies to fit the unconventional requirements of extreme operating conditions, discussing their main merits and limits compared to established and emerging technologies in this field, including silicon (Si), silicon on insulator (SOI), silicon germanium (SiGe), silicon carbide (SiC) as well as III–V semiconductors particularly the gallium nitride (GaN) semiconductor. In spite of successfully exceeding extreme conditions borders by developing advanced semiconductor devices dedicated for harsh environments, especially in high-temperature applications, the packaging challenges are still limiting the reliability of the developed technologies. Those challenges are examined in this review in terms of limitations and proposed solutions.

Mots clés

Extreme environment semiconductors and extreme environment packaging; harsh environment applications; high-temperature electronics