Items where Author is "Martin, T."

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Ghiotto, A., Parment, F., Martin, T., Vuong, T. P., & Wu, K. (2017, October). Air-filled substrate integrated waveguide - A flexible and low loss technological platform [Paper]. 13th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS 2017), Nis, Serbia. External link

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Martin, T., Parment, F., Ghiotto, A., Tan-Phu, V., & Wu, K. (2017, May). Air-Filled SIW interconnections for high performance millimeter-wave circuit and system prototyping and assembly [Paper]. IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2017), Seville, Spain. External link