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Air-Filled SIW interconnections for high performance millimeter-wave circuit and system prototyping and assembly

T. Martin, F. Parment, A. Ghiotto, Vuong Tan-Phu and Ke Wu

Paper (2017)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/38442/
Conference Title: IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2017)
Conference Location: Seville, Spain
Conference Date(s): 2017-05-17 - 2017-05-19
Publisher: IEEE
DOI: 10.1109/nemo.2017.7964267
Official URL: https://doi.org/10.1109/nemo.2017.7964267
Date Deposited: 18 Apr 2023 15:04
Last Modified: 05 Apr 2024 11:32
Cite in APA 7: Martin, T., Parment, F., Ghiotto, A., Tan-Phu, V., & Wu, K. (2017, May). Air-Filled SIW interconnections for high performance millimeter-wave circuit and system prototyping and assembly [Paper]. IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2017), Seville, Spain. https://doi.org/10.1109/nemo.2017.7964267

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