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Martin, T., Parment, F., Ghiotto, A., Tan-Phu, V., & Wu, K. (mai 2017). Air-Filled SIW interconnections for high performance millimeter-wave circuit and system prototyping and assembly [Communication écrite]. IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2017), Seville, Spain. Lien externe
Ghiotto, A., Parment, F., Martin, T., Vuong, T. P., & Wu, K. (octobre 2017). Air-filled substrate integrated waveguide - A flexible and low loss technological platform [Communication écrite]. 13th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS 2017), Nis, Serbia. Lien externe
