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Items where Author is "Martin, T."

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Jump to: 2017
Number of items: 2.

2017

Martin, T., Parment, F., Ghiotto, A., Tan-Phu, V., & Wu, K. (2017, May). Air-Filled SIW interconnections for high performance millimeter-wave circuit and system prototyping and assembly [Paper]. IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave and Terahertz Applications (NEMO 2017), Seville, Spain. External link

Ghiotto, A., Parment, F., Martin, T., Vuong, T. P., & Wu, K. (2017, October). Air-filled substrate integrated waveguide - A flexible and low loss technological platform [Paper]. 13th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS 2017), Nis, Serbia. External link

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