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Kittl, J. A., Pawlak, M. A., Torregiani, C., Lauwers, A., Demeurisse, C., Vrancken, C., Absil, P. P., Biesemans, S., Coia, C., Detavernier, C., Jordan-Sweet, J., & Lavoie, C. (2007). Transient and End Silicide Phase Formation in Thin Film Ni/Polycrystalline-Si Reactions for Fully Silicided Gate Applications. Applied Physics Letters, 91(17). Lien externe
Lavoie, C., Purtell, R., Coïa, C., Detavernier, C., Desjardins, P., Jordan-Sweet, J., Cabral, C. J., & D'Heurle, F. M. (mai 2002). In situ monitoring of thin film reactions during rapid thermal annealing: nickel silicide formation [Communication écrite]. Rapid thermal and other short-time processing technologies III Electrochemical Society, Philadelphia, PA, USA. Lien externe
